Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6943452 | Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality | Claude L. Bertin, Dennis Arthur Schmidt, William R. Tonti, Jerzy M. Zalesinski | 2005-09-13 |
| 6388198 | Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality | Claude L. Bertin, Dennis Arthur Schmidt, William R. Tonti, Jerzy M. Zalesinski | 2002-05-14 |
| 5923181 | Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module | Kenneth E. Beilstein, Jr., Claude L. Bertin, Dennis Charles Dubois, Wayne J. Howell, Christopher P. Miller +4 more | 1999-07-13 |
| 5702984 | Integrated mulitchip memory module, structure and fabrication | Claude L. Bertin, Wayne J. Howell, Erik L. Hedberg, Howard L. Kalter | 1997-12-30 |
| 5686843 | Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module | Kenneth E. Beilstein, Jr., Claude L. Bertin, Dennis Charles Dubois, Wayne J. Howell, Christopher P. Miller +4 more | 1997-11-11 |
| 5563086 | Integrated memory cube, structure and fabrication | Claude L. Bertin, Wayne J. Howell, Erik L. Hedberg, Howard L. Kalter | 1996-10-08 |
| 5561622 | Integrated memory cube structure | Claude L. Bertin, Wayne J. Howell, Erik L. Hedberg, Howard L. Kalter | 1996-10-01 |
| 5506753 | Method and apparatus for a stress relieved electronic module | Claude L. Bertin, Paul A. Farrar, Christopher P. Miller | 1996-04-09 |
| 5502667 | Integrated multichip memory module structure | Claude L. Bertin, Wayne J. Howell, Erik L. Hedberg, HOWARD KALTER | 1996-03-26 |
| 5426566 | Multichip integrated circuit packages and systems | Kenneth E. Beilstein, Jr., Claude L. Bertin, Howard L. Kalter, Christopher P. Miller, Dale E. Pontius +2 more | 1995-06-20 |
| 5309318 | Thermally enhanced semiconductor chip package | Kenneth E. Beilstein, Jr., Claude L. Bertin, Christopher P. Miller | 1994-05-03 |
| 5270261 | Three dimensional multichip package methods of fabrication | Claude L. Bertin, Paul A. Farrar, Howard L. Kalter, Willem B. van der Hoeven, Francis R. White | 1993-12-14 |
| 5202754 | Three-dimensional multichip packages and methods of fabrication | Claude L. Bertin, Paul A. Farrar, Howard L. Kalter, Willem B. van der Hoeven, Francis R. White | 1993-04-13 |
| 4999815 | Low power addressing systems | John E. Barth, Jr., Charles E. Drake, William Paul Hovis, Howard L. Kalter, Scott C. Lewis +2 more | 1991-03-12 |
| 4996587 | Integrated semiconductor chip package | Kurt Hinrichsmeyer, Werner Straehle, Richard W. Noth | 1991-02-26 |