Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5367124 | Compliant lead for surface mounting a chip package to a substrate | Herman S. Hoffman | 1994-11-22 |
| 5168368 | Lead frame-chip package with improved configuration | John Gow, 3rd | 1992-12-01 |
| 5138430 | High performance versatile thermally enhanced IC chip mounting | John Gow, 3rd | 1992-08-11 |
| 4996587 | Integrated semiconductor chip package | Kurt Hinrichsmeyer, Werner Straehle, Gordon A. Kelley, Jr. | 1991-02-26 |
| 4912547 | Tape bonded semiconductor device | James A. Bilowith, Edward John Dombroski, William H. Guthrie | 1990-03-27 |
| 4312116 | Method of sealing an electronic module in a cap | Floyd R. Moser | 1982-01-26 |