Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5168368 | Lead frame-chip package with improved configuration | Richard W. Noth | 1992-12-01 |
| 5138430 | High performance versatile thermally enhanced IC chip mounting | Richard W. Noth | 1992-08-11 |
| 5028983 | Multilevel integrated circuit packaging structures | Harry R. Bickford, Mark F. Bregman, Thomas M. Cipolla, Peter G. Ledermann, Ekkehard F. Miersch +5 more | 1991-07-02 |
| 4191938 | Cermet resistor trimming method | Herman S. Hoffman, Earl Stephans | 1980-03-04 |