UT

Uh-Po E. Tsou

IBM: 1 patents #44,794 of 70,183Top 65%
📍 South Burlington, VT: #758 of 1,136 inventorsTop 70%
🗺 Vermont: #3,027 of 4,968 inventorsTop 65%
Overall (All Time): #3,879,986 of 4,157,543Top 95%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5028983 Multilevel integrated circuit packaging structures Harry R. Bickford, Mark F. Bregman, Thomas M. Cipolla, John Gow, 3rd, Peter G. Ledermann +5 more 1991-07-02