Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8604828 | Variable voltage CMOS off-chip driver and receiver circuits | Paul W. Coteus, Robert H. Dennard, Daniel M. Dreps, Gerard V. Kopcsay | 2013-12-10 |
| 6060905 | Variable voltage, variable impedance CMOS off-chip driver and receiver interface and circuits | Chin-An Chang, Paul W. Coteus, Robert H. Dennard, Daniel M. Dreps, Gerard V. Kopcsay | 2000-05-09 |
| 5949272 | Bidirectional off-chip driver with receiver bypass | Paul W. Coteus, Warren E. Maule, Robert Dominick Mirabella | 1999-09-07 |
| 5874154 | Structure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive pattern | Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich, Linda C. Matthew +4 more | 1999-02-23 |
| 5800858 | Method for conditioning halogenated polymeric materials and structures fabricated therewith | Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich, Linda C. Matthew +4 more | 1998-09-01 |
| 5730890 | Method for conditioning halogenated polymeric materials and structures fabricated therewith | Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich, Linda C. Matthew, Stephen L. Tisdale +1 more | 1998-03-24 |
| 5709906 | Method for conditioning halogenated polymeric materials and structures fabricated therewith | Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich, Linda C. Matthew +4 more | 1998-01-20 |
| 5480841 | Process of multilayer conductor chip packaging | Paul W. Coteus, Linda C. Matthew | 1996-01-02 |
| 5399902 | Semiconductor chip packaging structure including a ground plane | Paul W. Coteus, Linda C. Matthew | 1995-03-21 |
| 5374454 | Method for conditioning halogenated polymeric materials and structures fabricated therewith | Peter J. Duke, Elizabeth Foster, Martin J. Goldberg, Voya R. Markovich, Linda C. Matthew +4 more | 1994-12-20 |
| 5318803 | Conditioning of a substrate for electroless plating thereon | Dennis A. Canfield, Arthur E. Graham, Stephen L. Tisdale, Alfred Viehbeck | 1994-06-07 |
| 5205461 | Method and apparatus for fluxless solder bonding | Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer, John C. Zyzo | 1993-04-27 |
| 5134460 | Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding | Michael John Brady, Sung Kwon Kang, Paul A. Moskowitz, James G. Ryan, Timothy C. Reiley +2 more | 1992-07-28 |
| 5028983 | Multilevel integrated circuit packaging structures | Mark F. Bregman, Thomas M. Cipolla, John Gow, 3rd, Peter G. Ledermann, Ekkehard F. Miersch +5 more | 1991-07-02 |
| 4956605 | Tab mounted chip burn-in apparatus | William L. Boland, Daniel Peter Morris, Timothy C. Reiley | 1990-09-11 |
| 4939570 | High power, pluggable tape automated bonding package | Lawrence S. Mok, Michael J. Palmer | 1990-07-03 |
| 4937006 | Method and apparatus for fluxless solder bonding | Raymond R. Horton, Ismail C. Novan, Michael J. Palmer, John C. Zyzo | 1990-06-26 |
| 4862322 | Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween | Mark F. Bregman, Paul A. Moskowitz, Michael J. Palmer, Timothy C. Reiley, Paige A. Poore +1 more | 1989-08-29 |
| 4832255 | Precision solder transfer method and means | Kurt R. Grebe, Caroline A. Kovac, Michael J. Palmer | 1989-05-23 |