EM

Ekkehard F. Miersch

IBM: 9 patents #11,918 of 70,183Top 20%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
📍 Eppelheim, NY: #3 of 3 inventorsTop 100%
Overall (All Time): #525,027 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
6434035 Memory system Simon Muff, Jens Pohl 2002-08-13
5232548 Discrete fabrication of multi-layer thin film, wiring structures Scott G. Ehrenberg, L. Wynn Herron, Jae Man Park, Janet L. Poetzinger 1993-08-03
5185073 Method of fabricating nendritic materials Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more 1993-02-09
5173392 Forming a pattern on a substrate Jae Man Park 1992-12-22
5137461 Separable electrical connection technology Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more 1992-08-11
5122439 Forming a pattern on a substrate Jae Man Park 1992-06-16
5028983 Multilevel integrated circuit packaging structures Harry R. Bickford, Mark F. Bregman, Thomas M. Cipolla, John Gow, 3rd, Peter G. Ledermann +5 more 1991-07-02
4937930 Method for forming a defect-free surface on a porous ceramic substrate James N. Humenik, Charles H. Perry, Janusz S. Wilczynski 1990-07-03
4445202 Electrically switchable permanent storage Volkmar Goetze, Guenther Potz 1984-04-24
4295183 Thin film metal package for LSI chips Lubomyr T. Romankiw 1981-10-13