Issued Patents All Time
Showing 25 most recent of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11077840 | Machine for augmentation, storage, and conservation of vehicle motive energy | — | 2021-08-03 |
| 10075050 | Switched reluctance motor and switched reluctance apparatus for hybrid vehicles | — | 2018-09-11 |
| 9963137 | Machine for augmentation, storage, and conservation of vehicle motive energy | — | 2018-05-08 |
| 9260005 | Machine for augmentation, storage, and conservation of vehicle motive energy | Paul Walter Martin, III | 2016-02-16 |
| 8700239 | Machine for augmentation, storage, and conservation of vehicle motive energy | Paul Walter Martin, III | 2014-04-15 |
| D664487 | Rotor | Paul Walter Martin, III | 2012-07-31 |
| D664080 | Rotor | Paul Walter Martin, III | 2012-07-24 |
| 7278207 | Method of making an electronic package | Lisa J. Jimarez, Miguel A. Jimarez, Voya R. Markovich, Cynthia S. Milkovich, Brenda Peterson | 2007-10-09 |
| 6988310 | Method of assembling an interconnect device assembly | Gerald G. Advocate, Jr., Norman D. Curry, Francis R. Krug, Jr., David C. Long, Daniel O'Connor +1 more | 2006-01-24 |
| 6961995 | Method of making an electronic package | Lisa J. Jimarez, Miguel A. Jimarez, Voya R. Markovich, Cynthia S. Milkovich, Brenda Peterson | 2005-11-08 |
| 6858111 | Conductive polymer interconnection configurations | Mark G. Courtney, Lewis S. Goldmann, Gregory B. Martin | 2005-02-22 |
| 6848914 | Electrical coupling of substrates by conductive buttons | Brian S. Beaman, William L. Brodsky, James A. Busby, Benson Chan, Voya R. Markovich | 2005-02-01 |
| 6711810 | Method of assembling a land grid array module | Todd H. Buley, Roger Lam, Daniel O'Connor | 2004-03-30 |
| 6548175 | Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof | Krishna G. Sachdev, Raymond A. Jackson, Amy B. Ostrander, Megan J. Shannon | 2003-04-15 |
| 6528145 | Polymer and ceramic composite electronic substrates | Daniel G. Berger, Shaji Farooq, Lester W. Herron, James N. Humenik, John U. Knickerbocker +2 more | 2003-03-04 |
| 6529021 | Self-scrub buckling beam probe | Yuet-Ying Yu, Daniel G. Berger, Camille P. Bowne, Scott I. Langenthal, Terence W. Spoor +1 more | 2003-03-04 |
| 6486415 | Compliant layer for encapsulated columns | Lisa J. Jimarez, Miguel A. Jimarez, Voya R. Markovich, Cynthia S. Milkovich, Brenda Peterson | 2002-11-26 |
| 6458623 | Conductive adhesive interconnection with insulating polymer carrier | Lewis S. Goldmann, Mario J. Interrante, Raymond A. Jackson, Amy B. Ostrander, Brenda Peterson | 2002-10-01 |
| 6404211 | Metal buckling beam probe | Harvey C. Hamel, Yuet-Ying Yu | 2002-06-11 |
| 6351134 | Semiconductor wafer test and burn-in | James M. Leas, Robert William Koss, Jody Van Horn, George F. Walker, David L. Gardell +2 more | 2002-02-26 |
| 6333104 | Conductive polymer interconnection configurations | Mark G. Courtney, Lewis S. Goldmann, Gregory B. Martin | 2001-12-25 |
| 6275051 | Segmented architecture for wafer test and burn-in | Thomas W. Bachelder, Dennis R. Barringer, Dennis R. Conti, James M. Crafts, David L. Gardell +5 more | 2001-08-14 |
| 6227943 | Method and system for pre-cleaning and post-cleaning deposited metal | John J. Garant, Srinivasa S. N. Reddy, Donald R. Wall | 2001-05-08 |
| 6221269 | Method of etching molybdenum metal from substrates | Krishna G. Sachdev, Umar M. Ahmad, Hsing H. Chen, Lawrence D. David, Donald R. Wall | 2001-04-24 |
| 6174175 | High density Z-axis connector | Alex A. Behfar, Dale Curtis McHerron | 2001-01-16 |