Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11085949 | Probe card assembly | David M. Audette, Dustin M. Fregeau, Peter W. Neff, Frederick H. Roy, III, Grant Wagner | 2021-08-10 |
| 10732202 | Repairable rigid test probe card assembly | Craig M. Bocash, Peter W. Neff | 2020-08-04 |
| 10578648 | Probe card assembly | David M. Audette, Dustin M. Fregeau, Peter W. Neff, Frederick H. Roy, III, Grant Wagner | 2020-03-03 |
| 10571490 | Solder bump array probe tip structure for laser cleaning | David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, Frederick H. Roy, III +2 more | 2020-02-25 |
| 10514393 | Gimbal assembly test system and method | David M. Audette, Peter W. Neff | 2019-12-24 |
| 10429414 | Multiple contact probe head disassembly method and system | Marvin Montaque, Stephen P. Ayotte | 2019-10-01 |
| 10288645 | Organic probe substrate | David M. Audette, Sukjay Chey, Steven A. Cordes, Anthony D. Fortin, John R. Maher +2 more | 2019-05-14 |
| 10041976 | Gimbal assembly test system and method | David M. Audette, Peter W. Neff | 2018-08-07 |
| 9835653 | Solder bump array probe tip structure for laser cleaning | David M. Audette, Dennis M. Bronson, Jr., Joseph K. V. Comeau, Dustin M. Fregeau, Frederick H. Roy, III +2 more | 2017-12-05 |
| 9797928 | Probe card assembly | David M. Audette, Dustin M. Fregeau, Peter W. Neff, Frederick H. Roy, III, Grant Wagner | 2017-10-24 |
| 9152517 | Programmable active thermal control | Harold W. Chase, Dennis R. Conti, James M. Crafts, Andrew T. Holle, Adrian Patrascu +1 more | 2015-10-06 |
| 9116200 | Methodologies and test configurations for testing thermal interface materials | Dustin M. Fregeau, Laura L. Kosbar, Keith C. Stevens, Grant Wagner | 2015-08-25 |
| 9086433 | Rigid probe with compliant characteristics | David M. Audette, Dustin M. Fregeau, Grant Wagner | 2015-07-21 |
| 9081034 | Rigid probe with compliant characteristics | David M. Audette, Dustin M. Fregeau, Grant Wagner | 2015-07-14 |
| 8917105 | Solder bump testing apparatus and methods of use | — | 2014-12-23 |
| 8836356 | Vertical probe assembly with air channel | David M. Audette, Dustin M. Fregeau, Daniel J. Murphy, Grant Wagner | 2014-09-16 |
| 8686749 | Thermal interface material, test structure and method of use | Brian M. Erwin, James N. Humenik, Rajneesh Kumar, John R. Lawson | 2014-04-01 |
| 8471575 | Methodologies and test configurations for testing thermal interface materials | Dustin M. Fregeau, Laura L. Kosbar, Keith C. Stevens, Grant Wagner | 2013-06-25 |
| 8002025 | Containment of a wafer-chuck thermal interface fluid | David M. Audette, Philip J. Diesing | 2011-08-23 |
| 7964542 | Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly | Krishna G. Sachdev, Mark S. Chace, Normand Cote, Jeffrey D. Gelorme, Sushumna Iruvanti +2 more | 2011-06-21 |
| 7808099 | Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method | Randall J. Bertrand, Mark S. Chace, George J. Lawson, Yvonne Morris, Charles L. Reynolds +1 more | 2010-10-05 |
| 7684194 | Systems and methods for cooling an electronic device | Govindarajan Natarajan, Raschid J. Bezama, James N. Humenik | 2010-03-23 |
| 7567090 | Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application | Normand Cote, Peter J. Demko, Jeffrey D. Gelorme, Marc D. Knox, George J. Lawson +1 more | 2009-07-28 |
| 7332927 | Apparatus for temporary thermal coupling of an electronic device to a heat sink during test | Paul J. Aube, Normand Cote, Roger Gamache, Paul M. Gaschke, Marc D. Knox +1 more | 2008-02-19 |
| 7265561 | Device burn in utilizing voltage control | Dennis R. Conti, Roger Gamache, Marc D. Knox, Jody Van Horn | 2007-09-04 |