Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7259580 | Method and apparatus for temporary thermal coupling of an electronic device to a heat sink during test | Paul J. Aube, Normand Cote, Roger Gamache, Paul M. Gaschke, Marc D. Knox +1 more | 2007-08-21 |
| 7084651 | Probe card assembly | David M. Audette, John F. Hagios, Christopher Sullivan | 2006-08-01 |
| 6911836 | Apparatus for functional and stress testing of exposed chip land grid array devices | Lonnie J. Cannon, John Saunders Corbin, Jr., Jose Arturo Garza, Jr., Jeffrey Frank Kutner, Kenneth Carl Larsen +2 more | 2005-06-28 |
| 6720789 | Method for wafer test and wafer test system for implementing the method | David M. Audette, John F. Hagios | 2004-04-13 |
| 6590404 | Force and centrality measuring tool | Edward J. Sukuskas | 2003-07-08 |
| 6577146 | Method of burning in an integrated circuit chip package | Roger Gamache, Marc D. Knox | 2003-06-10 |
| 6504392 | Actively controlled heat sink for convective burn-in oven | John A. Fredeman, Marc D. Knox, Mark R. LaForce | 2003-01-07 |
| 6351134 | Semiconductor wafer test and burn-in | James M. Leas, Robert William Koss, Jody Van Horn, George F. Walker, Charles H. Perry +2 more | 2002-02-26 |
| 6275051 | Segmented architecture for wafer test and burn-in | Thomas W. Bachelder, Dennis R. Barringer, Dennis R. Conti, James M. Crafts, Paul M. Gaschke +5 more | 2001-08-14 |
| 6173760 | Co-axial bellows liquid heatsink for high power module test | Krisztian Gaspar, Guy Morin | 2001-01-16 |
| 6086387 | Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing | Ethan E. Gallagher, Paul M. Gaschke | 2000-07-11 |
| 6050326 | Method and apparatus for cooling an electronic device | Richard J. Evans, Anthony M. Palagonia | 2000-04-18 |
| 6012020 | Apparatus and method for monitoring the condition of septic tanks | Steven E. Gardell, Eric W Gardell | 2000-01-04 |
| 5929651 | Semiconductor wafer test and burn-in | James M. Leas, Robert William Koss, Jody Van Horn, George F. Walker, Charles H. Perry +2 more | 1999-07-27 |
| 5628889 | High power capacity magnetron cathode | David C. Strippe | 1997-05-13 |
| 5585600 | Encapsulated semiconductor chip module and method of forming the same | Francis E. Froebel, Gary H. Irish, Mohammed S. Shaikh | 1996-12-17 |
| 5252062 | Thermal processing furnace | Robert F. Groves, Lynda L. Eaton, Paul H. Boileau | 1993-10-12 |