Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5585600 | Encapsulated semiconductor chip module and method of forming the same | David L. Gardell, Gary H. Irish, Mohammed S. Shaikh | 1996-12-17 |
| 5576246 | Personalized area leadframe coining or half etching for reduced mechanical stress at device edge | Harold W. Conru, Albert J. Gregoritsch, Jr., Sheldon C. Rieley, Stephen G. Starr, Ronald R. Uttecht +2 more | 1996-11-19 |
| 5545921 | Personalized area leadframe coining or half etching for reduced mechanical stress at device edge | Harold W. Conru, Albert J. Gregoritsch, Jr., Sheldon C. Rieley, Stephen G. Starr, Ronald R. Uttecht +2 more | 1996-08-13 |