| 5855993 |
Electronic devices having metallurgies containing copper-semiconductor compounds |
Michael John Brady, Curtis E. Farrell, Sung Kwon Kang, Jeffrey R. Marino, Donald Joseph Mikalsen +5 more |
1999-01-05 |
| 5776801 |
Leadframe having contact pads defined by a polymer insulating film |
James L. Carper, Gary H. Irish, Robert M. Smith, Robert Jackson |
1998-07-07 |
| 5633047 |
Electronic devices having metallurgies containing copper-semiconductor compounds |
Michael John Brady, Curtis E. Farrell, Sung Kwon Kang, Jeffrey R. Marino, Donald Joseph Mikalsen +5 more |
1997-05-27 |
| 5608260 |
Leadframe having contact pads defined by a polymer insulating film |
James L. Carper, Gary H. Irish, Robert M. Smith, Robert Jackson |
1997-03-04 |
| 5576246 |
Personalized area leadframe coining or half etching for reduced mechanical stress at device edge |
Harold W. Conru, Francis E. Froebel, Albert J. Gregoritsch, Jr., Stephen G. Starr, Ronald R. Uttecht +2 more |
1996-11-19 |
| 5545921 |
Personalized area leadframe coining or half etching for reduced mechanical stress at device edge |
Harold W. Conru, Francis E. Froebel, Albert J. Gregoritsch, Jr., Stephen G. Starr, Ronald R. Uttecht +2 more |
1996-08-13 |
