Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6603195 | Planarized plastic package modules for integrated circuits | David V. Caletka, James L. Carper, John P. Cincotta, Kibby B. Horsford, John J. Lajza, Jr. +4 more | 2003-08-05 |
| 5776801 | Leadframe having contact pads defined by a polymer insulating film | James L. Carper, Sheldon C. Rieley, Robert M. Smith, Robert Jackson | 1998-07-07 |
| 5608260 | Leadframe having contact pads defined by a polymer insulating film | James L. Carper, Sheldon C. Rieley, Robert M. Smith, Robert Jackson | 1997-03-04 |
| 5585600 | Encapsulated semiconductor chip module and method of forming the same | Francis E. Froebel, David L. Gardell, Mohammed S. Shaikh | 1996-12-17 |
| 5151559 | Planarized thin film surface covered wire bonded semiconductor package | H. Ward Conru, Francis J. Pakulski, William J. Slattery, Stephen G. Starr, William Ward | 1992-09-29 |
| 5086018 | Method of making a planarized thin film covered wire bonded semiconductor package | H. Ward Conru, Francis J. Pakulski, William J. Slattery, Stephen G. Starr, William Ward | 1992-02-04 |