| 7703199 |
Method to accommodate increase in volume expansion during solder reflow |
Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel |
2010-04-27 |
$6,715,000 |
| 7499614 |
Passive alignment of VCSELs to waveguides in opto-electronic cards and printed circuit boards |
Eric A. Johnson |
2009-03-03 |
$5,705,000 |
| 7348261 |
Wafer scale thin film package |
Seungbae Park, Sanjeev Sathe |
2008-03-25 |
$5,860,000 |
| 7086147 |
Method of accommodating in volume expansion during solder reflow |
Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel |
2006-08-08 |
$2,377,000 |
| 6933619 |
Electronic package and method of forming |
Eric A. Johnson |
2005-08-23 |
$5,305,000 |
| 6913948 |
Partially captured oriented interconnections for BGA packages and a method of forming the interconnections |
Eric A. Johnson |
2005-07-05 |
$5,545,000 |
| 6905961 |
Land grid array stiffener for use with flexible chip carriers |
Krishna Darbha, William Infantolino, Eric A. Johnson |
2005-06-14 |
$9,509,000 |
| 6774474 |
Partially captured oriented interconnections for BGA packages and a method of forming the interconnections |
Eric A. Johnson |
2004-08-10 |
$6,982,000 |
| 6695623 |
Enhanced electrical/mechanical connection for electronic devices |
William L. Brodsky, Michael A. Gaynes, Voya R. Markovich |
2004-02-24 |
$14,484,000 |
| 6686664 |
Structure to accommodate increase in volume expansion during solder reflow |
Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel |
2004-02-03 |
$8,997,000 |
| 6672500 |
Method for producing a reliable solder joint interconnection |
Kevin Knadle, Charles G. Woychik |
2004-01-06 |
$7,683,000 |
| 6649833 |
Negative volume expansion lead-free electrical connection |
Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel |
2003-11-18 |
$6,722,000 |
| 6627998 |
Wafer scale thin film package |
Seungbae Park, Sanjeev Sathe |
2003-09-30 |
$10,221,000 |
| 6603195 |
Planarized plastic package modules for integrated circuits |
James L. Carper, John P. Cincotta, Kibby B. Horsford, Gary H. Irish, John J. Lajza, Jr. +4 more |
2003-08-05 |
$11,866,000 |
| 6595784 |
Interposer member having apertures for relieving stress and increasing contact compliancy |
William L. Brodsky |
2003-07-22 |
$10,485,000 |
| 6541857 |
Method of forming BGA interconnections having mixed solder profiles |
Eric A. Johnson |
2003-04-01 |
$11,931,000 |
| 6528892 |
Land grid array stiffener use with flexible chip carriers |
Krishna Darbha, William Infantolino, Eric A. Johnson |
2003-03-04 |
$10,423,000 |
| 6507116 |
Electronic package and method of forming |
Eric A. Johnson |
2003-01-14 |
$20,025,000 |
| 6433283 |
Dual purpose ribbon cable |
William L. Brodsky, William Infantolino |
2002-08-13 |
$10,700,000 |
| 6410988 |
Thermally enhanced and mechanically balanced flip chip package and method of forming |
Jean Dery, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson, Luis J. Matienzo +1 more |
2002-06-25 |
$16,651,000 |
| 6333551 |
Surface profiling in electronic packages for reducing thermally induced interfacial stresses |
Eric A. Johnson |
2001-12-25 |
|
| 6293455 |
Method for producing a reliable BGA solder joint interconnection |
Kevin Knadle, Charles G. Woychik |
2001-09-25 |
$32,998,000 |
| 6274474 |
Method of forming BGA interconnections having mixed solder profiles |
Eric A. Johnson |
2001-08-14 |
$21,171,000 |
| 6268567 |
Dual purpose ribbon cable |
William L. Brodsky, William Infantolino |
2001-07-31 |
$29,242,000 |
| 6138893 |
Method for producing a reliable BGA solder joint interconnection |
Kevin Knadle, Charles G. Woychik |
2000-10-31 |
$31,312,000 |
