Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10739209 | Carbon nanotube-based multi-sensor | Dominique Drouin, Hélène Frémont, Simon Landry, Aurore F. M. E. Quelennec, Umar Shafique +1 more | 2020-08-11 |
| 10636763 | Enhanced cleaning for water-soluble flux soldering | Charles C. Bureau, Kang-Wook Lee, Isabelle Paquin, Dragoljub Veljanovic | 2020-04-28 |
| 10564047 | Carbon nanotube-based multi-sensor | Dominique Drouin, Hélène Frémont, Simon Landry, Aurore F. M. E. Quelennec, Umar Shafique +1 more | 2020-02-18 |
| 9818717 | Enhanced cleaning for water-soluble flux soldering | Charles C. Bureau, Kang-Wook Lee, Isabelle Paquin, Dragoljub Veljanovic | 2017-11-14 |
| 9162937 | Process to make olefins from organics with reduced side reactions | Giacomo Grasso, Nikolai Nesterenko, Sander Van Donk, Jean-Pierre Dath | 2015-10-20 |
| 8822609 | Method for transforming a single reactor line | Louis Fouarge | 2014-09-02 |
| 8710161 | Method for transforming a single reactor line | Louis Fouarge | 2014-04-29 |
| 7780801 | Flux composition and process for use thereof | Kang-Wook Lee, Valerie Oberson | 2010-08-24 |
| 7771541 | Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces | Claude Blais, Kang-Wook Lee, Sylvain Ouimet, Gerald J. Scilla | 2010-08-10 |
| 7740713 | Flux composition and techniques for use thereof | Michael A. Gaynes, Timothy A. Gosselin, Kang-Wook Lee, Valerie Oberson | 2010-06-22 |
| 7484190 | Method to optimize the manufacturing of interconnects in microelectronic packages | Julien Sylvestre | 2009-01-27 |
| 7176563 | Electronically grounded heat spreader | Michael A. Gaynes | 2007-02-13 |
| 6984286 | Adjusting fillet geometry to couple a heat spreader to a chip carrier | Barry A. Bonitz, Michael A. Gaynes, Eric A. Johnson | 2006-01-10 |
| 6819566 | Grounding and thermal dissipation for integrated circuit packages | David Danovitch | 2004-11-16 |
| 6545869 | Adjusting fillet geometry to couple a heat spreader to a chip carrier | Barry A. Bonitz, Michael A. Gaynes, Eric A. Johnson | 2003-04-08 |
| 6410988 | Thermally enhanced and mechanically balanced flip chip package and method of forming | David V. Caletka, Jean Dery, Michael A. Gaynes, Eric A. Johnson, Luis J. Matienzo +1 more | 2002-06-25 |
| 6104093 | Thermally enhanced and mechanically balanced flip chip package and method of forming | David V. Caletka, Jean Dery, Michael A. Gaynes, Eric A. Johnson, Luis J. Matienzo +1 more | 2000-08-15 |