| 10739209 |
Carbon nanotube-based multi-sensor |
Dominique Drouin, Hélène Frémont, Simon Landry, Aurore F. M. E. Quelennec, Umar Shafique +1 more |
2020-08-11 |
$2,122,000 |
| 10636763 |
Enhanced cleaning for water-soluble flux soldering |
Charles C. Bureau, Kang-Wook Lee, Isabelle Paquin, Dragoljub Veljanovic |
2020-04-28 |
$4,123,000 |
| 10564047 |
Carbon nanotube-based multi-sensor |
Dominique Drouin, Hélène Frémont, Simon Landry, Aurore F. M. E. Quelennec, Umar Shafique +1 more |
2020-02-18 |
$2,353,000 |
| 9818717 |
Enhanced cleaning for water-soluble flux soldering |
Charles C. Bureau, Kang-Wook Lee, Isabelle Paquin, Dragoljub Veljanovic |
2017-11-14 |
$4,491,000 |
| 9162937 |
Process to make olefins from organics with reduced side reactions |
Giacomo Grasso, Nikolai Nesterenko, Sander Van Donk, Jean-Pierre Dath |
2015-10-20 |
$8,000,000 |
| 8822609 |
Method for transforming a single reactor line |
Louis Fouarge |
2014-09-02 |
$7,817,000 |
| 8710161 |
Method for transforming a single reactor line |
Louis Fouarge |
2014-04-29 |
$36,816,000 |
| 7780801 |
Flux composition and process for use thereof |
Kang-Wook Lee, Valerie Oberson |
2010-08-24 |
$3,306,000 |
| 7771541 |
Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces |
Claude Blais, Kang-Wook Lee, Sylvain Ouimet, Gerald J. Scilla |
2010-08-10 |
$5,029,000 |
| 7740713 |
Flux composition and techniques for use thereof |
Michael A. Gaynes, Timothy A. Gosselin, Kang-Wook Lee, Valerie Oberson |
2010-06-22 |
$6,664,000 |
| 7484190 |
Method to optimize the manufacturing of interconnects in microelectronic packages |
Julien Sylvestre |
2009-01-27 |
$4,993,000 |
| 7176563 |
Electronically grounded heat spreader |
Michael A. Gaynes |
2007-02-13 |
$5,980,000 |
| 6984286 |
Adjusting fillet geometry to couple a heat spreader to a chip carrier |
Barry A. Bonitz, Michael A. Gaynes, Eric A. Johnson |
2006-01-10 |
$6,796,000 |
| 6819566 |
Grounding and thermal dissipation for integrated circuit packages |
David Danovitch |
2004-11-16 |
$5,414,000 |
| 6545869 |
Adjusting fillet geometry to couple a heat spreader to a chip carrier |
Barry A. Bonitz, Michael A. Gaynes, Eric A. Johnson |
2003-04-08 |
$14,785,000 |
| 6410988 |
Thermally enhanced and mechanically balanced flip chip package and method of forming |
David V. Caletka, Jean Dery, Michael A. Gaynes, Eric A. Johnson, Luis J. Matienzo +1 more |
2002-06-25 |
$16,651,000 |
| 6104093 |
Thermally enhanced and mechanically balanced flip chip package and method of forming |
David V. Caletka, Jean Dery, Michael A. Gaynes, Eric A. Johnson, Luis J. Matienzo +1 more |
2000-08-15 |
$26,064,000 |
