Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7094966 | Packaging integrated circuits with adhesive posts | Eric A. Johnson, Michael B. Vincent | 2006-08-22 |
| 6984286 | Adjusting fillet geometry to couple a heat spreader to a chip carrier | Eric Duchesne, Michael A. Gaynes, Eric A. Johnson | 2006-01-10 |
| 6545869 | Adjusting fillet geometry to couple a heat spreader to a chip carrier | Eric Duchesne, Michael A. Gaynes, Eric A. Johnson | 2003-04-08 |
| 5414928 | Method of making an electronic package assembly with protective encapsulant material | James V. Ellerson, Kishen N. Kapur, Jack M. McCreary, Irving Memis, Gerald M. Vettel | 1995-05-16 |