Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5414928 | Method of making an electronic package assembly with protective encapsulant material | Barry A. Bonitz, James V. Ellerson, Kishen N. Kapur, Irving Memis, Gerald M. Vettel | 1995-05-16 |
| 5378307 | Fluid treatment apparatus | Steven L. Bard, Gerald A. Bendz, Michael J. Canestaro, John R. Chapura, Edward Jay Frankoski +4 more | 1995-01-03 |
| 5292688 | Solder interconnection structure on organic substrates and process for making | Richard Hsiao, Voya R. Markovich, Donald P. Seraphim | 1994-03-08 |
| 5274913 | Method of fabricating a reworkable module | Kurt R. Grebe, Darbha Suryanarayana, Ho-Ming Tong | 1994-01-04 |
| 5121190 | Solder interconnection structure on organic substrates | Richard Hsiao, Voya R. Markovich, Donald P. Seraphim | 1992-06-09 |