Issued Patents All Time
Showing 25 most recent of 253 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9756724 | Method of making a circuitized substrate | Rabindra N. Das, Kostas Papathomas | 2017-09-05 |
| 9451693 | Electrically conductive adhesive (ECA) for multilayer device interconnects | Rabindra N. Das, John M. Lauffer, Roy H. Magnuson, Konstantinos I. Papathomas, Benson Chan | 2016-09-20 |
| 9351408 | Coreless layer buildup structure with LGA and joining layer | Timothy Antesberger, Frank D. Egitto, William E. Wilson, Rabindra N. Das | 2016-05-24 |
| 8685284 | Conducting paste for device level interconnects | Rabindra N. Das, Roy H. Magnuson, Mark D. Poliks | 2014-04-01 |
| 8592299 | Solder and electrically conductive adhesive based interconnection for CZT crystal attach | Rabindra N. Das, Rajinder S. Rai, Michael B. Vincent | 2013-11-26 |
| 8558374 | Electronic package with thermal interposer and method of making same | Rabindra N. Das, Frank D. Egitto, James J. McNamara, Jr. | 2013-10-15 |
| 8541687 | Coreless layer buildup structure | Timothy Antesberger, Frank D. Egitto, William E. Wilson, Rabindra N. Das | 2013-09-24 |
| 8536459 | Coreless layer buildup structure with LGA | Timothy Antesberger, Frank D. Egitto, William E. Wilson, Rabindra N. Das | 2013-09-17 |
| 8499440 | Method of making halogen-free circuitized substrate with reduced thermal expansion | Robert M. Japp, Kostas I. Papthomas | 2013-08-06 |
| 8501575 | Method of forming multilayer capacitors in a printed circuit substrate | Rabindra N. Das, Frank D. Egitto, How T. Lin, John M. Lauffer | 2013-08-06 |
| 8499445 | Method of forming an electrically conductive printed line | Rabindra N. Das, Frank D. Egitto | 2013-08-06 |
| 8446707 | Circuitized substrate with low loss capacitive material and method of making same | Rabindra N. Das, Konstantinos I. Papathomas, James J. McNamara, Jr. | 2013-05-21 |
| 8405229 | Electronic package including high density interposer and circuitized substrate assembly utilizing same | Timothy Antesberger, Frank D. Egitto, William E. Wilson | 2013-03-26 |
| 8299371 | Circuitized substrate with dielectric interposer assembly and method | Rabindra N. Das, John M. Lauffer, James J. McNamara, Jr. | 2012-10-30 |
| 8288857 | Anti-tamper microchip package based on thermal nanofluids or fluids | Rabindra N. Das, James J. McNamara, Jr., Mark D. Poliks | 2012-10-16 |
| 8247703 | Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate | Rabindra N. Das, John M. Lauffer | 2012-08-21 |
| 8245392 | Method of making high density interposer and electronic package utilizing same | Timothy Antesberger, Frank D. Egitto, William E. Wilson | 2012-08-21 |
| 8240031 | Method of joining a semiconductor device/chip to a printed wiring board | Ronald V. Smith, How T. Lin, Frank D. Egitto, Rabindra N. Das, William E. Wilson +1 more | 2012-08-14 |
| 8242376 | Circuitized substrates utilizing smooth-sided conductive layers as part thereof | John M. Lauffer, Michael Wozniak | 2012-08-14 |
| 8211790 | Multilayered circuitized substrate with P-aramid dielectric layers and method of making same | Robert M. Japp, Kostas Papathomas, Mark D. Poliks | 2012-07-03 |
| 8198739 | Semi-conductor chip with compressible contact structure and electronic package utilizing same | How T. Lin, Frank D. Egitto | 2012-06-12 |
| 8084863 | Circuitized substrate with continuous thermoplastic support film dielectric layers | Robert M. Japp, Kostas Papathomas, Mark D. Poliks | 2011-12-27 |
| 8063315 | Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate | Rabindra N. Das, Kostas Papathomas | 2011-11-22 |
| 7981245 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Frank D. Egitto, Donald S. Farquhar, Mark D. Poliks, Douglas O. Powell | 2011-07-19 |
| 7977034 | Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner | John M. Lauffer, James J. McNamara, Jr., Peter A. Moschak | 2011-07-12 |