Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658424 | Superconducting integrated circuit | William D. Oliver, David J. Hover, Danna Rosenberg, Xhovalin Miloshi, Vladimir Bolkhovsky +3 more | 2020-05-19 |
| 10586909 | Cryogenic electronic packages and assemblies | Eric A. Dauler | 2020-03-10 |
| 10418350 | Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure | Donna-Ruth W. Yost, Chenson K. Chen, Keith Warner, Steven A. Vitale, Mark A. Gouker +1 more | 2019-09-17 |
| 10396269 | Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits | William D. Oliver, Andrew J. Kerman, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker | 2019-08-27 |
| 10381541 | Cryogenic electronic packages and methods for fabricating cryogenic electronic packages | Eric A. Dauler | 2019-08-13 |
| 10242968 | Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages | Eric A. Dauler | 2019-03-26 |
| 10229897 | Multi-layer semiconductor structure and methods for fabricating multi-layer semiconductor structures | — | 2019-03-12 |
| 10199553 | Shielded through via structures and methods for fabricating shielded through via structures | William D. Oliver, Andrew J. Kerman, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker | 2019-02-05 |
| 10134972 | Qubit and coupler circuit structures and coupling techniques | William D. Oliver, Andrew J. Kerman, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker | 2018-11-20 |
| 10121754 | Interconnect structures and methods for fabricating interconnect structures | William D. Oliver, Andrew J. Kerman, Donna-Ruth W. Yost, Danna Rosenberg, Mark A. Gouker | 2018-11-06 |
| 10079224 | Interconnect structures for assembly of semiconductor structures including at least one integrated circuit structure | Donna-Ruth W. Yost, Chenson K. Chen, Keith Warner, Steven A. Vitale, Mark A. Gouker +1 more | 2018-09-18 |
| 9881904 | Multi-layer semiconductor devices fabricated using a combination of substrate and via structures and fabrication techniques | Mark A. Gouker, Pascale Gouker, Leonard M. Johnson, Ryan C. Johnson | 2018-01-30 |
| 9812429 | Interconnect structures for assembly of multi-layer semiconductor devices | Mark A. Gouker, Pascale Gouker, Leonard M. Johnson, Ryan C. Johnson | 2017-11-07 |
| 9786633 | Interconnect structures for fine pitch assembly of semiconductor structures and related techniques | Peter G. Murphy, Karen E. Magoon, Noyan Kinayman, Michael J. Barbieri, Timothy M. Hancock +1 more | 2017-10-10 |
| 9780075 | Interconnect structures for assembly of multi-layer semiconductor devices | Donna-Ruth W. Yost, Chenson K. Chen, Keith Warner, Steven A. Vitale, Mark A. Gouker +1 more | 2017-10-03 |
| 9756724 | Method of making a circuitized substrate | Kostas Papathomas, Voya R. Markovich | 2017-09-05 |
| 9451693 | Electrically conductive adhesive (ECA) for multilayer device interconnects | Voya R. Markovich, John M. Lauffer, Roy H. Magnuson, Konstantinos I. Papathomas, Benson Chan | 2016-09-20 |
| 9420689 | Method of making a circuitized substrate | Michael Rowlands | 2016-08-16 |
| 9351408 | Coreless layer buildup structure with LGA and joining layer | Voya R. Markovich, Timothy Antesberger, Frank D. Egitto, William E. Wilson | 2016-05-24 |
| 8685284 | Conducting paste for device level interconnects | Roy H. Magnuson, Mark D. Poliks, Voya R. Markovich | 2014-04-01 |
| 8607445 | Substrate having internal capacitor and method of making same | Frank D. Egitto, John M. Lauffer, How T. Lin | 2013-12-17 |
| 8592299 | Solder and electrically conductive adhesive based interconnection for CZT crystal attach | Voya R. Markovich, Rajinder S. Rai, Michael B. Vincent | 2013-11-26 |
| 8558374 | Electronic package with thermal interposer and method of making same | Voya R. Markovich, Frank D. Egitto, James J. McNamara, Jr. | 2013-10-15 |
| 8541687 | Coreless layer buildup structure | Voya R. Markovich, Timothy Antesberger, Frank D. Egitto, William E. Wilson | 2013-09-24 |
| 8536459 | Coreless layer buildup structure with LGA | Voya R. Markovich, Timothy Antesberger, Frank D. Egitto, William E. Wilson | 2013-09-17 |