Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658424 | Superconducting integrated circuit | William D. Oliver, Rabindra N. Das, David J. Hover, Danna Rosenberg, Xhovalin Miloshi +3 more | 2020-05-19 |
| 10418350 | Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure | Rabindra N. Das, Donna-Ruth W. Yost, Chenson K. Chen, Keith Warner, Steven A. Vitale +1 more | 2019-09-17 |
| 10396269 | Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits | William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg | 2019-08-27 |
| 10199553 | Shielded through via structures and methods for fabricating shielded through via structures | William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg | 2019-02-05 |
| 10134972 | Qubit and coupler circuit structures and coupling techniques | William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg | 2018-11-20 |
| 10121754 | Interconnect structures and methods for fabricating interconnect structures | William D. Oliver, Andrew J. Kerman, Rabindra N. Das, Donna-Ruth W. Yost, Danna Rosenberg | 2018-11-06 |
| 10079224 | Interconnect structures for assembly of semiconductor structures including at least one integrated circuit structure | Rabindra N. Das, Donna-Ruth W. Yost, Chenson K. Chen, Keith Warner, Steven A. Vitale +1 more | 2018-09-18 |
| 9881904 | Multi-layer semiconductor devices fabricated using a combination of substrate and via structures and fabrication techniques | Rabindra N. Das, Pascale Gouker, Leonard M. Johnson, Ryan C. Johnson | 2018-01-30 |
| 9812429 | Interconnect structures for assembly of multi-layer semiconductor devices | Rabindra N. Das, Pascale Gouker, Leonard M. Johnson, Ryan C. Johnson | 2017-11-07 |
| 9786633 | Interconnect structures for fine pitch assembly of semiconductor structures and related techniques | Rabindra N. Das, Peter G. Murphy, Karen E. Magoon, Noyan Kinayman, Michael J. Barbieri +1 more | 2017-10-10 |
| 9780075 | Interconnect structures for assembly of multi-layer semiconductor devices | Rabindra N. Das, Donna-Ruth W. Yost, Chenson K. Chen, Keith Warner, Steven A. Vitale +1 more | 2017-10-03 |
| 7061447 | Reconfigurable antennas using microelectromechanical (MEMs) shutters and methods to utilize such | Carl O. Bozler, Sean M. Duffy | 2006-06-13 |