Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9881904 | Multi-layer semiconductor devices fabricated using a combination of substrate and via structures and fabrication techniques | Rabindra N. Das, Mark A. Gouker, Leonard M. Johnson, Ryan C. Johnson | 2018-01-30 |
| 9812429 | Interconnect structures for assembly of multi-layer semiconductor devices | Rabindra N. Das, Mark A. Gouker, Leonard M. Johnson, Ryan C. Johnson | 2017-11-07 |