Kostas Papathomas — 59 Patents at IBM

Kostas Papathomas has been granted 59 US patents while listed as an inventor at IBM. The first was granted in 1991 and the most recent in September 2017. Kostas Papathomas ranks #40,067 of 4,157,543 US inventors in our database (top 0.96%). Patent records list Kostas Papathomas in Endicott, NY, US.

Issued Patents All Time

Showing 1–25 of 59 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9756724	Method of making a circuitized substrate	Rabindra N. Das, Voya R. Markovich	2017-09-05
8445094	Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers	Robert M. Japp	2013-05-21
8211790	Multilayered circuitized substrate with P-aramid dielectric layers and method of making same	Robert M. Japp, Voya R. Markovich, Mark D. Poliks	2012-07-03
8198551	Power core for use in circuitized substrate and method of making same	Robert M. Japp, John S. Kresge, Timothy Antesberger	2012-06-12
8084863	Circuitized substrate with continuous thermoplastic support film dielectric layers	Robert M. Japp, Voya R. Markovich, Mark D. Poliks	2011-12-27
8063315	Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate	Rabindra N. Das, Voya R. Markovich	2011-11-22
7931830	Dielectric composition for use in circuitized substrates and circuitized substrate including same	Robert M. Japp, Voya R. Markovich	2011-04-26
7646098	Multilayered circuitized substrate with p-aramid dielectric layers and method of making same	Robert M. Japp, Voya R. Markovich, Mark D. Poliks	2010-01-12
7541265	Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate	Rabindra N. Das, John M. Lauffer, Mark D. Poliks	2009-06-02
7508076	Information handling system including a circuitized substrate having a dielectric layer without continuous fibers	Robert M. Japp, Voya R. Markovich, Cheryl Palomaki, David L. Thomas	2009-03-24
7470990	Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same	Robert M. Japp, Irving Memis	2008-12-30
7429789	Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same	Robert M. Japp, Voya R. Markovich	2008-09-30
7416972	Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion	Robert M. Japp, Irving Memis	2008-08-26
7416996	Method of making circuitized substrate	Robert M. Japp, Voya R. Markovich, Cheryl Palomaki, David L. Thomas	2008-08-26
7348677	Method of providing printed circuit board with conductive holes and board resulting therefrom	James M. Larnerd, John M. Lauffer, Voya R. Markovich	2008-03-25
7270845	Dielectric composition for forming dielectric layer for use in circuitized substrates	Robert M. Japp	2007-09-18
7211289	Method of making multilayered printed circuit board with filled conductive holes	James M. Larnerd, John M. Lauffer, Voya R. Markovich	2007-05-01
7145221	Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same	Irving Memis	2006-12-05
7078816	Circuitized substrate	Robert M. Japp, Voya R. Markovich, Cheryl Palomaki, David L. Thomas	2006-07-18
6609296	Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means	Donald S. Farquhar, Voya R. Markovich, Leonard L. Schmidt	2003-08-26	$17,117,000
6555762	Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition	Bernd Karl Appelt, Jeffrey D. Gelorme, Sung Kwon Kang, Voya R. Markovich, Sampath Purushothaman	2003-04-29	$13,645,000
6376158	Methods for selectively filling apertures	Gerald W. Jones, Heike Marcello	2002-04-23	$16,630,000
6323436	High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer	Jeffrey Hedrick, Amarjit S. Rai, Stephen L. Tisdale, Alfred Viehbeck	2001-11-27	$23,652,000
6207595	Laminate and method of manufacture thereof	Bernd Karl Appelt, Lawrence Robert Blumberg, William Thomas Fotorny, Ross Downey Havens, Robert M. Japp +3 more	2001-03-27	$29,796,000
6199751	Polymer with transient liquid phase bondable particles	Michael A. Gaynes, Giana M. Phelan, Charles G. Woychik	2001-03-13	$29,262,000

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Kostas Papathomas — 59 Patents

Issued Patents All Time

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