Issued Patents All Time
Showing 25 most recent of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9756724 | Method of making a circuitized substrate | Rabindra N. Das, Voya R. Markovich | 2017-09-05 |
| 8445094 | Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers | Robert M. Japp | 2013-05-21 |
| 8211790 | Multilayered circuitized substrate with P-aramid dielectric layers and method of making same | Robert M. Japp, Voya R. Markovich, Mark D. Poliks | 2012-07-03 |
| 8198551 | Power core for use in circuitized substrate and method of making same | Robert M. Japp, John S. Kresge, Timothy Antesberger | 2012-06-12 |
| 8084863 | Circuitized substrate with continuous thermoplastic support film dielectric layers | Robert M. Japp, Voya R. Markovich, Mark D. Poliks | 2011-12-27 |
| 8063315 | Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate | Rabindra N. Das, Voya R. Markovich | 2011-11-22 |
| 7931830 | Dielectric composition for use in circuitized substrates and circuitized substrate including same | Robert M. Japp, Voya R. Markovich | 2011-04-26 |
| 7646098 | Multilayered circuitized substrate with p-aramid dielectric layers and method of making same | Robert M. Japp, Voya R. Markovich, Mark D. Poliks | 2010-01-12 |
| 7541265 | Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate | Rabindra N. Das, John M. Lauffer, Mark D. Poliks | 2009-06-02 |
| 7508076 | Information handling system including a circuitized substrate having a dielectric layer without continuous fibers | Robert M. Japp, Voya R. Markovich, Cheryl Palomaki, David L. Thomas | 2009-03-24 |
| 7470990 | Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same | Robert M. Japp, Irving Memis | 2008-12-30 |
| 7429789 | Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same | Robert M. Japp, Voya R. Markovich | 2008-09-30 |
| 7416972 | Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion | Robert M. Japp, Irving Memis | 2008-08-26 |
| 7416996 | Method of making circuitized substrate | Robert M. Japp, Voya R. Markovich, Cheryl Palomaki, David L. Thomas | 2008-08-26 |
| 7348677 | Method of providing printed circuit board with conductive holes and board resulting therefrom | James M. Larnerd, John M. Lauffer, Voya R. Markovich | 2008-03-25 |
| 7270845 | Dielectric composition for forming dielectric layer for use in circuitized substrates | Robert M. Japp | 2007-09-18 |
| 7211289 | Method of making multilayered printed circuit board with filled conductive holes | James M. Larnerd, John M. Lauffer, Voya R. Markovich | 2007-05-01 |
| 7145221 | Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same | Irving Memis | 2006-12-05 |
| 7078816 | Circuitized substrate | Robert M. Japp, Voya R. Markovich, Cheryl Palomaki, David L. Thomas | 2006-07-18 |
| 6609296 | Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means | Donald S. Farquhar, Voya R. Markovich, Leonard L. Schmidt | 2003-08-26 |
| 6555762 | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition | Bernd Karl Appelt, Jeffrey D. Gelorme, Sung Kwon Kang, Voya R. Markovich, Sampath Purushothaman | 2003-04-29 |
| 6376158 | Methods for selectively filling apertures | Gerald W. Jones, Heike Marcello | 2002-04-23 |
| 6323436 | High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer | Jeffrey Hedrick, Amarjit S. Rai, Stephen L. Tisdale, Alfred Viehbeck | 2001-11-27 |
| 6207595 | Laminate and method of manufacture thereof | Bernd Karl Appelt, Lawrence Robert Blumberg, William Thomas Fotorny, Ross Downey Havens, Robert M. Japp +3 more | 2001-03-27 |
| 6199751 | Polymer with transient liquid phase bondable particles | Michael A. Gaynes, Giana M. Phelan, Charles G. Woychik | 2001-03-13 |