TA

Timothy Antesberger

ET Endicott Interconnect Technologies: 8 patents #14 of 87Top 20%
CI Corning Incorporated: 4 patents #1,140 of 3,867Top 30%
Overall (All Time): #335,539 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12377594 System for manufacturing of honeycomb extrusion dies and manufacturing methods thereof Dana Eugene Coots, Neil James Sidebottom 2025-08-05
12122066 Extrusion dies and methods of manufacturing the same Dana Eugene Coots, Eric Jay Dacheux, Kevin Eugene Elliott, Gary Michael Huzinec, Neil James Sidebottom 2024-10-22
11833604 Method of preparing an electrode for use in forming a honeycomb extrusion die Dana Craig Bookbinder, Dana Eugene Coots, Seyed Amir Farzadfar, Dominick John Forenz, Ryan Joseph Grohsmeyer +5 more 2023-12-05
10611051 Systems and methods for skinning articles Brian Michael Adams, Richard Bomba, Marc Jason Cassada, Joseph Henry Citriniti, John Joseph Costello +9 more 2020-04-07
9351408 Coreless layer buildup structure with LGA and joining layer Voya R. Markovich, Frank D. Egitto, William E. Wilson, Rabindra N. Das 2016-05-24
8541687 Coreless layer buildup structure Voya R. Markovich, Frank D. Egitto, William E. Wilson, Rabindra N. Das 2013-09-24
8536459 Coreless layer buildup structure with LGA Voya R. Markovich, Frank D. Egitto, William E. Wilson, Rabindra N. Das 2013-09-17
8405229 Electronic package including high density interposer and circuitized substrate assembly utilizing same Frank D. Egitto, Voya R. Markovich, William E. Wilson 2013-03-26
8245392 Method of making high density interposer and electronic package utilizing same Frank D. Egitto, Voya R. Markovich, William E. Wilson 2012-08-21
8198551 Power core for use in circuitized substrate and method of making same Robert M. Japp, Kostas Papathomas, John S. Kresge 2012-06-12
7163847 Method of making circuitized substrate James W. Fuller, John J. Konrad, John S. Kresge, Stephen Krasniak, Timothy L. Wells 2007-01-16
7091066 Method of making circuitized substrate James W. Fuller, John J. Konrad, John S. Kresge, Stephen Krasniak, Timothy L. Wells 2006-08-15
7084014 Method of making circuitized substrate James W. Fuller, John J. Konrad, John S. Kresge, Stephen Krasniak, Timothy L. Wells 2006-08-01
6958106 Material separation to form segmented product John S. Kresge 2005-10-25