Issued Patents All Time
Showing 25 most recent of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8499440 | Method of making halogen-free circuitized substrate with reduced thermal expansion | Voya R. Markovich, Kostas I. Papthomas | 2013-08-06 |
| 8445094 | Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers | Kostas Papathomas | 2013-05-21 |
| 8211790 | Multilayered circuitized substrate with P-aramid dielectric layers and method of making same | Voya R. Markovich, Kostas Papathomas, Mark D. Poliks | 2012-07-03 |
| 8198551 | Power core for use in circuitized substrate and method of making same | Kostas Papathomas, John S. Kresge, Timothy Antesberger | 2012-06-12 |
| 8084863 | Circuitized substrate with continuous thermoplastic support film dielectric layers | Voya R. Markovich, Kostas Papathomas, Mark D. Poliks | 2011-12-27 |
| 7931830 | Dielectric composition for use in circuitized substrates and circuitized substrate including same | Voya R. Markovich, Kostas Papathomas | 2011-04-26 |
| 7687722 | Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same | Voya R. Markovich, Kostas I. Papthomas | 2010-03-30 |
| 7646098 | Multilayered circuitized substrate with p-aramid dielectric layers and method of making same | Voya R. Markovich, Kostas Papathomas, Mark D. Poliks | 2010-01-12 |
| 7596863 | Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein | Ashwinkumar C. Bhatt, Robert J. Harendza | 2009-10-06 |
| 7508076 | Information handling system including a circuitized substrate having a dielectric layer without continuous fibers | Voya R. Markovich, Cheryl Palomaki, Kostas Papathomas, David L. Thomas | 2009-03-24 |
| 7470990 | Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same | Irving Memis, Kostas Papathomas | 2008-12-30 |
| 7429789 | Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same | Voya R. Markovich, Kostas Papathomas | 2008-09-30 |
| 7416996 | Method of making circuitized substrate | Voya R. Markovich, Cheryl Palomaki, Kostas Papathomas, David L. Thomas | 2008-08-26 |
| 7416972 | Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion | Irving Memis, Kostas Papathomas | 2008-08-26 |
| 7381587 | Method of making circuitized substrate | John M. Lauffer, Voya R. Markovich, William E. Wilson | 2008-06-03 |
| 7329446 | Drill stack formation | Gregory Kevern, Francis S. Poch | 2008-02-12 |
| 7270845 | Dielectric composition for forming dielectric layer for use in circuitized substrates | Kostas Papathomas | 2007-09-18 |
| 7259333 | Composite laminate circuit structure | Gregory Kevern, William J. Rudik | 2007-08-21 |
| 7078816 | Circuitized substrate | Voya R. Markovich, Cheryl Palomaki, Kostas Papathomas, David L. Thomas | 2006-07-18 |
| 7070909 | UV absorbing glass cloth and use thereof | Pamela Lulkoski, Jeffrey McKeveny, Jan Obrzut, Kenneth Lynn Potter | 2006-07-04 |
| 6996903 | Formation of multisegmented plated through holes | Donald S. Farquhar, John M. Lauffer, Konstantinos I. Papathomas | 2006-02-14 |
| 6955849 | Method and structure for small pitch z-axis electrical interconnections | Brian E. Curcio, Frank D. Egitto, Thomas R. Miller, Manh-Quan Nguyen, Douglas O. Powell | 2005-10-18 |
| 6944946 | Porous power and ground planes for reduced PCB delamination and better reliability | Mark D. Poliks | 2005-09-20 |
| 6841026 | Method for reducing coefficient of thermal expansion in chip attach packages | Lawrence Robert Blumberg, William J. Rudik, John Frank Surowka | 2005-01-11 |
| 6838400 | UV absorbing glass cloth and use thereof | Pamela Lulkoski, Jeffrey McKeveny, Jan Obrzut, Kenneth Lynn Potter | 2005-01-04 |