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Robert M. Japp — 77 Patents

IBM: 60 patents #1,318 of 70,183Top 2%

ETEndicott Interconnect Technologies: 17 patents #7 of 87Top 9%

Vestal, NY: #4 of 481 inventorsTop 1%

New York: #917 of 115,490 inventorsTop 1%

Overall (All Time): #24,274 of 4,157,543Top 1%

77 Patents All Time

Robert M. Japp has been granted 77 US patents while listed as an inventor at IBM. The first was granted in 1987 and the most recent in August 2013. Robert M. Japp ranks #24,274 of 4,157,543 US inventors in our database (top 0.58%). Patent records list Robert M. Japp in Vestal, NY, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 77 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8499440	Method of making halogen-free circuitized substrate with reduced thermal expansion	Voya R. Markovich, Kostas I. Papthomas	2013-08-06
8445094	Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers	Kostas Papathomas	2013-05-21
8211790	Multilayered circuitized substrate with P-aramid dielectric layers and method of making same	Voya R. Markovich, Kostas Papathomas, Mark D. Poliks	2012-07-03
8198551	Power core for use in circuitized substrate and method of making same	Kostas Papathomas, John S. Kresge, Timothy Antesberger	2012-06-12
8084863	Circuitized substrate with continuous thermoplastic support film dielectric layers	Voya R. Markovich, Kostas Papathomas, Mark D. Poliks	2011-12-27
7931830	Dielectric composition for use in circuitized substrates and circuitized substrate including same	Voya R. Markovich, Kostas Papathomas	2011-04-26
7687722	Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same	Voya R. Markovich, Kostas I. Papthomas	2010-03-30
7646098	Multilayered circuitized substrate with p-aramid dielectric layers and method of making same	Voya R. Markovich, Kostas Papathomas, Mark D. Poliks	2010-01-12
7596863	Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein	Ashwinkumar C. Bhatt, Robert J. Harendza	2009-10-06
7508076	Information handling system including a circuitized substrate having a dielectric layer without continuous fibers	Voya R. Markovich, Cheryl Palomaki, Kostas Papathomas, David L. Thomas	2009-03-24
7470990	Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same	Irving Memis, Kostas Papathomas	2008-12-30
7429789	Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same	Voya R. Markovich, Kostas Papathomas	2008-09-30
7416996	Method of making circuitized substrate	Voya R. Markovich, Cheryl Palomaki, Kostas Papathomas, David L. Thomas	2008-08-26
7416972	Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion	Irving Memis, Kostas Papathomas	2008-08-26
7381587	Method of making circuitized substrate	John M. Lauffer, Voya R. Markovich, William E. Wilson	2008-06-03
7329446	Drill stack formation	Gregory Kevern, Francis S. Poch	2008-02-12	$10,496,000
7270845	Dielectric composition for forming dielectric layer for use in circuitized substrates	Kostas Papathomas	2007-09-18
7259333	Composite laminate circuit structure	Gregory Kevern, William J. Rudik	2007-08-21	$7,896,000
7078816	Circuitized substrate	Voya R. Markovich, Cheryl Palomaki, Kostas Papathomas, David L. Thomas	2006-07-18
7070909	UV absorbing glass cloth and use thereof	Pamela Lulkoski, Jeffrey McKeveny, Jan Obrzut, Kenneth Lynn Potter	2006-07-04
6996903	Formation of multisegmented plated through holes	Donald S. Farquhar, John M. Lauffer, Konstantinos I. Papathomas	2006-02-14	$5,958,000
6955849	Method and structure for small pitch z-axis electrical interconnections	Brian E. Curcio, Frank D. Egitto, Thomas R. Miller, Manh-Quan Nguyen, Douglas O. Powell	2005-10-18	$9,308,000
6944946	Porous power and ground planes for reduced PCB delamination and better reliability	Mark D. Poliks	2005-09-20	$5,282,000
6841026	Method for reducing coefficient of thermal expansion in chip attach packages	Lawrence Robert Blumberg, William J. Rudik, John Frank Surowka	2005-01-11	$11,104,000
6838400	UV absorbing glass cloth and use thereof	Pamela Lulkoski, Jeffrey McKeveny, Jan Obrzut, Kenneth Lynn Potter	2005-01-04	$10,543,000