Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Circuitized substrate with continuous thermoplastic support film dielectric layers

Circuitized substrate with continuous thermoplastic support film dielectric layers

US Patent 8084863 · Granted Dec 27, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Nanoparticle sensor having a nanofibrous membrane scaffold2022
Embedded thin films2018
Autonomous gamma, X-ray, and particle detector2017
Method of making a circuitized substrate2017
Method of making a circuitized substrate2017
Autonomous gamma, X-ray, and particle detector2017
Electrically conductive adhesive (ECA) for multilayer device interconnects2016
Coreless layer buildup structure with LGA and joining layer2016
Embedded thin films2014
Conducting paste for device level interconnects2014
Conducting paste for device level interconnects2014
Solder and electrically conductive adhesive based interconnection for CZT crysta2013