Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7332212 | Circuitized substrate with conductive polymer and seed material adhesion layer | Elizabeth Foster, Anita Sargent | 2008-02-19 | |
| 7329446 | Drill stack formation | Robert M. Japp, Francis S. Poch | 2008-02-12 | $10,496,000 |
| 7259333 | Composite laminate circuit structure | Robert M. Japp, William J. Rudik | 2007-08-21 | $7,896,000 |
| 7063762 | Circuitized substrate and method of making same | Elizabeth Foster, Anita Sargent | 2006-06-20 | |
| 6834426 | Method of fabricating a laminate circuit structure | Robert M. Japp, William J. Rudik | 2004-12-28 | $11,084,000 |
| 6669805 | Drill stack formation | Robert M. Japp, Francis S. Poch | 2003-12-30 | $8,971,000 |
| 6395998 | Electronic package having an adhesive retaining cavity | Donald S. Farquhar, Michael Joseph Klodowski | 2002-05-28 | $13,038,000 |