DF

Donald S. Farquhar

IBM: 72 patents #999 of 70,183Top 2%
GE: 9 patents #3,747 of 36,430Top 15%
IB International Business: 1 patents #4 of 119Top 4%
📍 Schenectady, NY: #17 of 1,353 inventorsTop 2%
🗺 New York: #813 of 115,490 inventorsTop 1%
Overall (All Time): #21,740 of 4,157,543Top 1%
82
Patents All Time

Issued Patents All Time

Showing 1–25 of 82 patents

Patent #TitleCo-InventorsDate
10168288 System for radiography imaging and method of operating such system Clifford Bueno, Tamas Gschwendtner, George Gibson Chalmers, Antonio Luigi Ibba 2019-01-01
9406470 Tri-stable flexure mechanism Stefan Rakuff, Ganesh Krishnamoorthy 2016-08-02
8674377 Optoelectronic device package, array and method of fabrication 2014-03-18
8450926 OLED lighting devices including electrodes with magnetic material Bruce Richard Roberts, Kevin PAYNE, Stefan Rakuff, Michael Scott Herzog 2013-05-28
8350470 Encapsulation structures of organic electroluminescence devices Ahmet Gun Erlat, Christian Maria Anton Heller, Anil Raj Duggal 2013-01-08
8344389 Optoelectronic device array Michael Scott Herzog 2013-01-01
8273980 Photovoltaic roof ridge cap and installation method Charles Steven Korman, Neil Anthony Johnson, Ali Esat Iz 2012-09-25
8137148 Method of manufacturing monolithic parallel interconnect structure Anil Raj Duggal, Michael Scott Herzog, Jeffrey Michael Youmans, Stefan Rakuff, Linda Ann Boyd 2012-03-20
8102119 Encapsulated optoelectronic device and method for making the same Michael Scott Herzog, Christian Maria Anton Heller 2012-01-24
7981245 Multi-layered interconnect structure using liquid crystalline polymer dielectric Frank D. Egitto, Voya R. Markovich, Mark D. Poliks, Douglas O. Powell 2011-07-19
7777136 Multi-layered interconnect structure using liquid crystalline polymer dielectric Frank D. Egitto, Voya R. Markovich, Mark D. Poliks, Douglas O. Powell 2010-08-17
7679921 Security cloth design and assembly Mario Cesana, Martino Taddei 2010-03-16
7402254 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements Brian E. Curcio, Konstantinos I. Papathomas, Mark D. Poliks 2008-07-22
7329816 Electronic package with optimized lamination process James D. Herard, Michael Joseph Klodowski, David L. Questad, Der-jin Woan 2008-02-12
7303639 Method for producing Z-axis interconnection assembly of printed wiring board elements Brian E. Curcio, Lisa J. Jimarez, Keith P. Brodock 2007-12-04
7301108 Multi-layered interconnect structure using liquid crystalline polymer dielectric Frank D. Egitto, Voya R. Markovich, Mark D. Poliks, Douglas O. Powell 2007-11-27
7240430 Manufacturing methods for printed circuit boards Bernd Karl Appelt, James R. Bupp, Ross W. Keesler, Michael Joseph Klodowski, Andrew Seman +1 more 2007-07-10
7128256 Z-interconnections with liquid crystal polymer dielectric films Douglas O. Powell 2006-10-31
7076869 Solid via layer to layer interconnect Brian E. Curcio, Voya R. Markovich, Konstantinos I. Papathomas 2006-07-18
7063756 Enhanced design and process for a conductive adhesive Gerald Paul Kohut, Andrew Seman, Michael Joseph Klodowski 2006-06-20
7059049 Electronic package with optimized lamination process James D. Herard, Michael Joseph Klodowski, David L. Questad, Der-jin Woan 2006-06-13
7014731 Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same Konstantinos I. Papathomas, Mark D. Poliks 2006-03-21
7007171 Method and apparatus for improved fold retention on a security enclosure Giuseppe Butturini, Mario Cesana, Fulvio Vittorio Fontana 2006-02-28
6996903 Formation of multisegmented plated through holes Robert M. Japp, John M. Lauffer, Konstantinos I. Papathomas 2006-02-14
6982642 Security cloth design and assembly Mario Cesana, Martino Taddei 2006-01-03