Issued Patents All Time
Showing 51–75 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6552263 | Method of injection molded flip chip encapsulation | Kostantinos Papathomas | 2003-04-22 |
| 6534724 | Enhanced design and process for a conductive adhesive | Gerard Paul Kohut, Andrew Seman, Michael Joseph Klodowski | 2003-03-18 |
| 6534160 | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same | Konstantinos I. Papathomas, Mark D. Poliks | 2003-03-18 |
| 6504111 | Solid via layer to layer interconnect | Brian E. Curcio, Voya R. Markovich, Konstantinos I. Papathomas | 2003-01-07 |
| 6503821 | Integrated circuit chip carrier assembly | Lisa J. Jimarez, Michael Joseph Klodowski, Jeffrey Zimmerman | 2003-01-07 |
| 6501171 | Flip chip package with improved cap design and process for making thereof | David E. Houser, Konstantinos I. Papathomas | 2002-12-31 |
| 6465084 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Konstantinos I. Papathomas, Mark D. Poliks | 2002-10-15 |
| 6429527 | Method and article for filling apertures in a high performance electronic substrate | Konstantinos I. Papathomas | 2002-08-06 |
| 6426470 | Formation of multisegmented plated through holes | Robert M. Japp, John M. Lauffer, Konstantinos I. Papathomas | 2002-07-30 |
| 6407461 | Injection molded integrated circuit chip assembly | Konstantinos I. Papathomas | 2002-06-18 |
| 6399896 | Circuit package having low modulus, conformal mounting pads | Frank J. Downes, Jr., Robert M. Japp, William J. Rudik | 2002-06-04 |
| 6395998 | Electronic package having an adhesive retaining cavity | Gregory Kevern, Michael Joseph Klodowski | 2002-05-28 |
| 6373717 | Electronic package with high density interconnect layer | Francis J. Downes, Jr., Elizabeth Foster, Robert M. Japp, Gerald W. Jones, John S. Kresge +3 more | 2002-04-16 |
| 6369449 | Method and apparatus for injection molded flip chip encapsulation | Michael Joseph Klodowski, Kostantinos Papathomas, James R. Wilcox | 2002-04-09 |
| 6335495 | Patterning a layered chrome-copper structure disposed on a dielectric substrate | Edmond O. Fey, Elizabeth Foster, Michael Joseph Klodowski | 2002-01-01 |
| 6329713 | Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate | Lisa J. Jimarez, Michael Joseph Klodowski, Jeffrey Zimmerman | 2001-12-11 |
| 6254972 | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same | Konstantinos I. Papathomas, Mark D. Poliks | 2001-07-03 |
| 6222136 | Printed circuit board with continuous connective bumps | Bernd Karl Appelt, James R. Bupp, Ross W. Keesler, Michael Joseph Klodowski, Andrew Seman +1 more | 2001-04-24 |
| 6214525 | Printed circuit board with circuitized cavity and methods of producing same | Christina M. Boyko, Robert M. Japp, Michael Joseph Klodowski | 2001-04-10 |
| 6187417 | Substrate having high optical contrast and method of making same | Konstantinos I. Papathomas | 2001-02-13 |
| 6125531 | Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means | Voya R. Markovich, Kostas Papathomas, Leonard L. Schmidt | 2000-10-03 |
| 6079100 | Method of making a printed circuit board having filled holes and fill member for use therewith | Voya R. Markovich, Kostas Papathomas, Leonard L. Schmidt | 2000-06-27 |
| 6066386 | Printed circuit board with cavity for circuitization | Christina M. Boyko, Robert M. Japp, Michael Joseph Klodowski | 2000-05-23 |
| 6015520 | Method for filling holes in printed wiring boards | Bernd Karl Appelt, Christina M. Boyko, Stephen Joseph Fuerniss, Michael Joseph Klodowski | 2000-01-18 |
| 5993579 | High performance electrical cable and method of manufacture | William L. Brodsky, Natalie B. Feilchenfeld, Lisa J. Jimarez, James R. Wilcox | 1999-11-30 |