Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6887779 | Integrated circuit structure | David J. Alcoe, Gerald W. Jones, John S. Kresge, Cheryl L. Tytran-Palomaki | 2005-05-03 |
| 6829823 | Method of making a multi-layered interconnect structure | Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones, John S. Kresge +3 more | 2004-12-14 |
| 6720502 | Integrated circuit structure | David J. Alcoe, Gerald W. Jones, John S. Kresge, Cheryl L. Tytran-Palomaki | 2004-04-13 |
| 6693031 | Formation of a metallic interlocking structure | Gerald G. Advocate, Jr., Luis J. Matienzo, Ronald A. Kaschak, John S. Kresge, Daniel C. Van Hart | 2004-02-17 |
| 6626196 | Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing | Raymond T. Galasco, Lawrence P. Lehman, Robert D. Topa | 2003-09-30 |
| 6569604 | Blind via formation in a photoimageable dielectric material | Anilkumar C. Bhatt, Robert Lee Lewis, JR., Voya R. Markovich | 2003-05-27 |
| 6429384 | Chip C4 assembly improvement using magnetic force and adhesive | Robert M. Japp, Mark V. Pierson | 2002-08-06 |
| 6373717 | Electronic package with high density interconnect layer | Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones, John S. Kresge +3 more | 2002-04-16 |
| 6348737 | Metallic interlocking structure | Gerald G. Advocate, Jr., Luis J. Matienzo, Ronald A. Kaschak, John S. Kresge, Daniel C. Van Hart | 2002-02-19 |
| 6176985 | Laminated electroplating rack and connection system for optimized plating | Raymond T. Galasco, Robert M. Japp, John Frank Surowka | 2001-01-23 |
| 6150255 | Method of planarizing a curved substrate and resulting structure | Stephen Joseph Fuerniss, Gary R. Hill, Anthony P. Ingraham, Voya R. Markovich, Jaynal A. Molla | 2000-11-21 |
| 6142361 | Chip C4 assembly improvement using magnetic force and adhesive | Robert M. Japp, Mark V. Pierson | 2000-11-07 |
| 6043150 | Method for uniform plating of dendrites | Raymond T. Galasco, Jaynal A. Molla | 2000-03-28 |
| 5994910 | Apparatus, and corresponding method, for stress testing wire bond-type semi-conductor chips | Anthony P. Ingraham, Jaynal A. Molla | 1999-11-30 |
| 5939786 | Uniform plating of dendrites | Raymond T. Galasco, Jaynal A. Molla | 1999-08-17 |
| 5940729 | Method of planarizing a curved substrate and resulting structure | Stephen Joseph Fuerniss, Gary R. Hill, Anthony P. Ingraham, Voya R. Markovich, Jaynal A. Molla | 1999-08-17 |
| 5230782 | Electrolytic process for reducing the organic content of an aqueous composition and apparatus therefore | Oscar A. Moreno, Cindy M. Reidsema, Joseph E. Varsik | 1993-07-27 |