Issued Patents All Time
Showing 1–25 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094801 | Thick-silver layer interface | Lakshminarayan Viswanathan | 2024-09-17 |
| 11749639 | Die-substrate assemblies having sinter-bonded backside via structures and associated fabrication methods | Lakshminarayan Viswanathan | 2023-09-05 |
| 11616040 | Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods | Tianwei Sun | 2023-03-28 |
| 11437276 | Packaged dies with metal outer layers extending from die back sides toward die front sides | Lakshminarayan Viswanathan, David F. Abdo, Colby Greg Rampley, Fernando A. Santos | 2022-09-06 |
| 11128268 | Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof | Sharan Kishore, Lakshminarayan Viswanathan, Tianwei Sun, David J. Dougherty | 2021-09-21 |
| 10923451 | Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods | Tianwei Sun | 2021-02-16 |
| 10861764 | Microelectronic components having integrated heat dissipation posts and systems including the same | Lakshminarayan Viswanathan, Mahesh K. Shah, Lu Li, David F. Abdo, Geoffrey Tucker +3 more | 2020-12-08 |
| 10825747 | Semiconductor device package and methods of manufacture thereof | Li Li, Lakshminarayan Viswanathan | 2020-11-03 |
| 10741446 | Method of wafer dicing for wafers with backside metallization and packaged dies | Lakshminarayan Viswanathan, David F. Abdo, Colby Greg Rampley, Fernando A. Santos | 2020-08-11 |
| 10727153 | Thick-silver layer interface | Lakshminarayan Viswanathan | 2020-07-28 |
| 10529638 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos | 2020-01-07 |
| 10485091 | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof | Lakshminarayan Viswanathan, Elie A. Maalouf, Geoffrey Tucker | 2019-11-19 |
| 10431449 | Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof | Lakshminarayan Viswanathan, Geoffrey Tucker | 2019-10-01 |
| 10396006 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos | 2019-08-27 |
| 10269678 | Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof | Lakshminarayan Viswanathan, Mahesh K. Shah, Lu Li, David F. Abdo, Geoffrey Tucker +3 more | 2019-04-23 |
| 10199303 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos | 2019-02-05 |
| 10199302 | Molded air cavity packages and methods for the production thereof | Audel A. Sanchez, Lakshminarayan Viswanathan, Fernando A. Santos | 2019-02-05 |
| 10141182 | Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof | Lakshminarayan Viswanathan, Geoffrey Tucker | 2018-11-27 |
| 9941210 | Semiconductor devices with protruding conductive vias and methods of making such devices | Lakshminarayan Viswanathan, Mali Mahalingam, Colby Greg Rampley | 2018-04-10 |
| 9922894 | Air cavity packages and methods for the production thereof | Lakshminarayan Viswanathan, David F. Abdo, Mali Mahalingam, Carl E. D'Acosta | 2018-03-20 |
| 9875987 | Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices | Lakshminarayan Viswanathan | 2018-01-23 |
| 9799580 | Semiconductor device package and methods of manufacture thereof | Li Li, Lakshminarayan Viswanathan | 2017-10-24 |
| 9698116 | Thick-silver layer interface for a semiconductor die and corresponding thermal layer | Lakshminarayan Viswanathan | 2017-07-04 |
| 9589860 | Electronic devices with semiconductor die coupled to a thermally conductive substrate | Lakshminarayan Viswanathan | 2017-03-07 |
| 9538659 | Solder wettable flanges and devices and systems incorporating solder wettable flanges | Lakshminarayan Viswanathan, Mahesh K. Shah | 2017-01-03 |