Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425161 | Semiconductor device with mechanical lock features between a semiconductor die and a substrate | Lakshminarayan Viswanathan, L. M. Mahalingam, David F. Abdo | 2016-08-23 |
| 9099567 | Packaged semiconductor devices and methods of their fabrication | Lakshminarayan Viswanathan, L. M. Mahalingam, David F. Abdo | 2015-08-04 |
| 7829980 | Magnetoresistive device and method of packaging same | Eric J. Salter | 2010-11-09 |
| 7598596 | Methods and apparatus for a dual-metal magnetic shield structure | Gregory W. Grynkewich, Eric J. Salter | 2009-10-06 |
| 7402529 | Method of applying cladding material on conductive lines of MRAM devices | John D'Urso, Kelly Kyler, Bradley N. Engel, Gregory W. Grynkewich, Nicholas Rizzo | 2008-07-22 |
| 7279341 | Method for fabricating a flux concentrating system for use in a magnetoelectronics device | Thomas V. Meixner, Gregory W. Grynkewich, J. Ren, Richard Williams, Brian R. Butcher +1 more | 2007-10-09 |
| 7105363 | Cladded conductor for use in a magnetoelectronics device and method for fabricating the same | Mark Durlam, Jeffrey H. Baker, Brian R. Butcher, Mark Deherrera, John D'Urso +5 more | 2006-09-12 |
| 6943038 | Method for fabricating a flux concentrating system for use in a magnetoelectronics device | Thomas V. Meixner, Gregory W. Grynkewich, J. Ren, Richard Williams, Brian R. Butcher +1 more | 2005-09-13 |
| 6936763 | Magnetic shielding for electronic circuits which include magnetic materials | Nicholas Rizzo, Mark Durlam, Michael Roll, Kelly Kyler | 2005-08-30 |
| 6927072 | Method of applying cladding material on conductive lines of MRAM devices | John D'Urso, Kelly Kyler, Bradley N. Engel, Gregory W. Grynkewich, Nicholas Rizzo | 2005-08-09 |
| 6885074 | Cladded conductor for use in a magnetoelectronics device and method for fabricating the same | Mark Durlam, Jeffrey H. Baker, Brian R. Butcher, Mark Deherrera, John D'Urso +5 more | 2005-04-26 |
| 6517698 | System and method for providing rotation to plating flow | Timothy L. Johnson, Douglas G. Mitchell | 2003-02-11 |
| 6414509 | Method and apparatus for in-situ testing of integrated circuit chips | Anilkumar C. Bhatt, Leo Raymond Buda, Robert D. Edwards, Paul Joseph Hart, Anthony P. Ingraham +6 more | 2002-07-02 |
| 6362089 | Method for processing a semiconductor substrate having a copper surface disposed thereon and structure formed | Owen R. Fay | 2002-03-26 |
| 6150255 | Method of planarizing a curved substrate and resulting structure | Francis J. Downes, Jr., Stephen Joseph Fuerniss, Gary R. Hill, Anthony P. Ingraham, Voya R. Markovich | 2000-11-21 |
| 6137213 | Field emission device having a vacuum bridge focusing structure and method | Curtis D. Moyer, Peter A. Smith, Robert H. Reuss, Troy Trottier, Steven A. Voight +4 more | 2000-10-24 |
| 6043150 | Method for uniform plating of dendrites | Francis J. Downes, Jr., Raymond T. Galasco | 2000-03-28 |
| 5994910 | Apparatus, and corresponding method, for stress testing wire bond-type semi-conductor chips | Francis J. Downes, Jr., Anthony P. Ingraham | 1999-11-30 |
| 5940729 | Method of planarizing a curved substrate and resulting structure | Francis J. Downes, Jr., Stephen Joseph Fuerniss, Gary R. Hill, Anthony P. Ingraham, Voya R. Markovich | 1999-08-17 |
| 5939786 | Uniform plating of dendrites | Francis J. Downes, Jr., Raymond T. Galasco | 1999-08-17 |
| 5910641 | Selectively filled adhesives for compliant, reworkable, and solder-free flip chip interconnection and encapsulation | Michael A. Gaynes | 1999-06-08 |
| 5813870 | Selectively filled adhesives for semiconductor chip interconnection and encapsulation | Michael A. Gaynes, Steven P. Ostrander, Judith Marie Roldan, George J. Saxenmeyer, Jr., George F. Walker | 1998-09-29 |
| 5798050 | Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate | Michael A. Gaynes | 1998-08-25 |
| 5759046 | Dendritic interconnection system | Anthony P. Ingraham, David B. Stone | 1998-06-02 |
| 5435057 | Interconnection method and structure for organic circuit boards | Perminder S. Bindra, Ross Downey Havens, Voya R. Markovich | 1995-07-25 |