Issued Patents All Time
Showing 25 most recent of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12184237 | Surface-mount amplifier devices | Lu Ll, Li Ll, Zhiwei Gong, Fernando A. Santos, Elie A. Maalouf +1 more | 2024-12-31 |
| 12094801 | Thick-silver layer interface | Jaynal A. Molla | 2024-09-17 |
| 12040291 | Radio frequency packages containing multilevel power substrates and associated fabrication methods | Zhiwei Gong, Li Li, Lu Li, Fernando A. Santos, Burton J. Carpenter | 2024-07-16 |
| 12015004 | Hybrid device assemblies and method of fabrication | Li Li, Jeffrey K. Jones | 2024-06-18 |
| 12014971 | Thermal interface structures, electrical systems with thermal interface structures, and methods of manufacture thereof | Lu Li, Sharan Kishore, Freek Egbert van Straten | 2024-06-18 |
| 11990872 | Power amplifier modules including topside cooling interfaces and methods for the fabrication thereof | Geoffrey Tucker, Jeffrey K. Jones, Elie A. Maalouf | 2024-05-21 |
| 11984429 | Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereof | Yun Wei, Scott D. Marshall, Taek Kyu Kim, Ricardo Uscola, Fernando A. Santos | 2024-05-14 |
| 11929310 | Radio frequency packages containing substrates with coefficient of thermal expansion matched mount pads and associated fabrication methods | Lu Li, Freek Egbert van Straten | 2024-03-12 |
| 11830842 | Hybrid device assemblies and method of fabrication | Li Li, Jeffrey K. Jones | 2023-11-28 |
| 11749639 | Die-substrate assemblies having sinter-bonded backside via structures and associated fabrication methods | Jaynal A. Molla | 2023-09-05 |
| 11621228 | Substrate with thermal vias and sinter-bonded thermal dissipation structure | Lu Li, Freek Egbert van Straten | 2023-04-04 |
| 11621673 | Power amplifier packages and systems incorporating design-flexible package platforms | Jean-Christophe Nanan, David J. Dougherty, Scott D. Marshall, Xavier Hue | 2023-04-04 |
| 11621231 | Methods of fabricating leadless power amplifier packages including topside terminations | Yun Wei, Fernando A. Santos, Scott D. Marshall | 2023-04-04 |
| 11437276 | Packaged dies with metal outer layers extending from die back sides toward die front sides | Jaynal A. Molla, David F. Abdo, Colby Greg Rampley, Fernando A. Santos | 2022-09-06 |
| 11343919 | Packaged electronic devices with top terminations | Fernando A. Santos, Audel A. Sanchez, Jerry L. White | 2022-05-24 |
| 11342275 | Leadless power amplifier packages including topside terminations and methods for the fabrication thereof | Yun Wei, Fernando A. Santos, Scott D. Marshall | 2022-05-24 |
| 11196390 | Power amplifier devices containing frontside heat extraction structures and methods for the fabrication thereof | Edward Christian Mares, David J. Dougherty | 2021-12-07 |
| 11128268 | Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof | Sharan Kishore, Jaynal A. Molla, Tianwei Sun, David J. Dougherty | 2021-09-21 |
| 10861764 | Microelectronic components having integrated heat dissipation posts and systems including the same | Mahesh K. Shah, Lu Li, David F. Abdo, Geoffrey Tucker, Carl E. D'Acosta +3 more | 2020-12-08 |
| 10861774 | Internally-shielded microelectronic packages and methods for the fabrication thereof | Audel A. Sanchez, Vikas Shilimkar, Ramanujam Srinidhi Embar | 2020-12-08 |
| 10825747 | Semiconductor device package and methods of manufacture thereof | Li Li, Jaynal A. Molla | 2020-11-03 |
| 10806021 | Packaged microelectronic component mounting using sinter attachment | Lu Li, Mahesh K. Shah, Paul R. Hart | 2020-10-13 |
| 10785862 | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof | Elie A. Maalouf, Geoffrey Tucker | 2020-09-22 |
| 10741446 | Method of wafer dicing for wafers with backside metallization and packaged dies | Jaynal A. Molla, David F. Abdo, Colby Greg Rampley, Fernando A. Santos | 2020-08-11 |
| 10727153 | Thick-silver layer interface | Jaynal A. Molla | 2020-07-28 |