Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347753 | Semiconductor device having galvanic isolation and method therefor | Jerry Rudiak, Fred T. Brauchler | 2025-07-01 |
| 12040291 | Radio frequency packages containing multilevel power substrates and associated fabrication methods | Zhiwei Gong, Li Li, Lu Li, Lakshminarayan Viswanathan, Fernando A. Santos | 2024-07-16 |
| 11967507 | Tie bar removal for semiconductor device packaging | Richard Te Gan, Rushik P. Tank, Zhiwei Gong, Jinmei Liu | 2024-04-23 |
| 11502068 | Semiconductor device package having galvanic isolation and method therefor | Fred T. Brauchler | 2022-11-15 |
| 11462494 | Semiconductor device package having galvanic isolation and method therefor | Fred T. Brauchler | 2022-10-04 |
| 11222790 | Tie bar removal for semiconductor device packaging | Richard Te Gan, Rushik P. Tank, Zhiwei Gong, Jinmei Liu | 2022-01-11 |
| 11164826 | Packaged integrated circuit having stacked die and method for making | Fred T. Brauchler | 2021-11-02 |
| 10734311 | Hybrid lead frame for semiconductor die package with improved creepage distance | Mariano Layson Ching, Jr., Lidong Zhang, Kendall D. Phillips, Quan Chen, Meng Kong Lye | 2020-08-04 |
| 10734312 | Packaged integrated circuit having stacked die and method for therefor | Kim R. Gauen | 2020-08-04 |
| 10734327 | Lead reduction for improved creepage distance | Mariano Layson Ching, Jr., Jinmei Liu, Yit Meng Lee, Allen Marfil Descartin | 2020-08-04 |
| 10446476 | Packaged integrated circuit having stacked die and method for therefor | Leo M. Higgins, III, Fred T. Brauchler, Jinmei Liu, Mariano Layson Ching, Jr., Jinzhong Yao +3 more | 2019-10-15 |
| 10325876 | Surface finish for wirebonding | Varughese Mathew, Leo M. Higgins, III, Chu-Chung Lee, Tu-Anh N. Tran | 2019-06-18 |
| 10249557 | Packaged integrated circuit device and methods | Leo M. Higgins, III | 2019-04-02 |
| 10242935 | Packaged semiconductor device and method for forming | Leo M. Higgins, III | 2019-03-26 |
| 9437459 | Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure | Chu-Chung Lee, Tu-Anh N. Tran | 2016-09-06 |
| 9368470 | Coated bonding wire and methods for bonding using same | Chu-Chung Lee, Tu-Anh N. Tran | 2016-06-14 |
| 9324675 | Structures for reducing corrosion in wire bonds | Chu-Chung Lee, Tu-Anh N. Tran | 2016-04-26 |
| 9111878 | Method for forming a semiconductor device assembly having a heat spreader | Leo M. Higgins, III | 2015-08-18 |
| 9111937 | Semiconductor devices with multilayer flex interconnect structures | Twila J. Eichman | 2015-08-18 |
| 9059144 | Method for forming die assembly with heat spreader | Leo M. Higgins, III, Glenn G. Daves | 2015-06-16 |
| 9012263 | Method for treating a bond pad of a package substrate | Varughese Mathew, Leo M. Higgins, III | 2015-04-21 |
| 8802508 | Semiconductor device package | Boon Yew Low, Shufeng Zhao | 2014-08-12 |
| 8754518 | Devices and methods for configuring conductive elements for a semiconductor package | Derek S. Swanson | 2014-06-17 |
| 8754521 | Semiconductor device assembly having a heat spreader | Leo M. Higgins, III, Yuan Yuan | 2014-06-17 |
| 8704370 | Semiconductor package structure having an air gap and method for forming | Trent S. Uehling, Brett P. Wilkerson | 2014-04-22 |