Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10537019 | Substrate dielectric crack prevention using interleaved metal plane | Tingdong Zhou, Stanley Andrew Cejka, James S. Golab, Chee Seng Foong | 2020-01-14 |
| 9111937 | Semiconductor devices with multilayer flex interconnect structures | Burton J. Carpenter | 2015-08-18 |