Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10537019 | Substrate dielectric crack prevention using interleaved metal plane | Tingdong Zhou, Twila J. Eichman, James S. Golab, Chee Seng Foong | 2020-01-14 |
| 10256193 | Methods and devices with enhanced grounding and shielding for wire bond structures | James S. Golab, Robert J. Wenzel | 2019-04-09 |
| 10147654 | Package materials monitor and method therefor | Tingdong Zhou | 2018-12-04 |
| 9377504 | Integrated circuit interconnect crack monitor circuit | Steven A. Atherton, William J. Downey, James C. Golab, Brian David Young | 2016-06-28 |