Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308331 | Via structure for semiconductor dies | Yaoyu Pang | 2025-05-20 |
| 11887924 | Chip scale package | Craig MCADAM, Jonathan Taylor, Douglas J.W. MACFARLANE, John L. Kerr, James MUNGER +1 more | 2024-01-30 |
| 11562952 | Chip scale package | Craig MCADAM, Jonathan Taylor, Douglas J.W. MACFARLANE, John L. Kerr, James MUNGER +1 more | 2023-01-24 |
| 11373968 | Via structure for semiconductor dies | Yaoyu Pang | 2022-06-28 |
| 10049988 | Semiconductor device package substrate having a fiducial mark | — | 2018-08-14 |
| 9627255 | Semiconductor device package substrate having a fiducial mark | — | 2017-04-18 |
| 9377504 | Integrated circuit interconnect crack monitor circuit | Stanley Andrew Cejka, William J. Downey, James C. Golab, Brian David Young | 2016-06-28 |