Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308331 | Via structure for semiconductor dies | Steven A. Atherton | 2025-05-20 |
| 11373968 | Via structure for semiconductor dies | Steven A. Atherton | 2022-06-28 |
| 11322465 | Metal layer patterning for minimizing mechanical stress in integrated circuit packages | Kathryn R. Holland, Marc Tarabbia, Alexander L. Barr | 2022-05-03 |
| 10468318 | Stiffener for providing uniformity in microelectronic packages | Mudasir Ahmad, Weidong Xie, Qiang Wang | 2019-11-05 |
| 10230212 | Method and apparatus to prevent laser kink failures | Mudasir Ahmad, Weidong Xie, Chiyu Liu, Qiang Wang | 2019-03-12 |
| 9281269 | Integrated circuit package and method of manufacture | Jaimal Mallory Williamson, Nima Shahidi | 2016-03-08 |