| 12035466 |
Systems and methods for manufacturing thin substrate |
Mark J. Beesley, Meng Chi Lee, Hao Shi, Quan Qi |
2024-07-09 |
| 10490515 |
Semiconductor substrate having stress-absorbing surface layer |
Jaimal Mallory Williamson, Jose Carlos Arroyo |
2019-11-26 |
| 10347589 |
Semiconductor substrate having stress-absorbing surface layer |
Jaimal Mallory Williamson, Jose Carlos Arroyo |
2019-07-09 |
| 9673065 |
Semiconductor substrate having stress-absorbing surface layer |
Jaimal Mallory Williamson, Jose Carlos Arroyo |
2017-06-06 |
| 9281269 |
Integrated circuit package and method of manufacture |
Jaimal Mallory Williamson, Yaoyu Pang |
2016-03-08 |
| 8896118 |
Electronic assembly with copper pillar attach substrate |
— |
2014-11-25 |
| 8013036 |
Modified rubber particles and compositions including the same |
Hamid Arastoopour, Fouad Teymour |
2011-09-06 |
| 7816446 |
Interpenetrated rubber particles and compositions including the same |
Hamid Arastoopour, Fouad Teymour |
2010-10-19 |
| 6513737 |
Apparatus and process for pulverization of a polymeric material |
George Ivanov, Hamid Arastoopour, Ecevit Bilgili, Barry Bernstein |
2003-02-04 |
