Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12376231 | Three-dimensional (3D) copper in printed circuit boards | Anne M. Mason, Chad O. Simpson, William Hannon | 2025-07-29 |
| 12035466 | Systems and methods for manufacturing thin substrate | Meng Chi Lee, Nima Shahidi, Hao Shi, Quan Qi | 2024-07-09 |
| 11956898 | Three-dimensional (3D) copper in printed circuit boards | Anne M. Mason, Chad O. Simpson, William Hannon | 2024-04-09 |
| 11388817 | Electrical components attached to fabric | Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian +7 more | 2022-07-12 |
| 10959331 | Electrical components attached to fabric | Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian +7 more | 2021-03-23 |
| 10701802 | Electrical components attached to fabric | Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian +7 more | 2020-06-30 |
| 10485103 | Electrical components attached to fabric | Daniel D. Sunshine, David M. Kindlon, Michael B. Nussbaum, Andrew L. Rosenberg, Andrew Sterian +7 more | 2019-11-19 |
| 10455707 | Connection pad for embedded components in PCB packaging | Kenneth Leland Kiplinger, Shawn X. Arnold, Shyam Harindralal Ratnayake, Meng Chi Lee | 2019-10-22 |
| 10420213 | Segmented via for vertical PCB interconnect | Albert A. Onderick, II, Anne M. Mason, Craig A. Gammel, Shawn X. Arnold | 2019-09-17 |
| 10191550 | Fabric devices with shape memory alloy wires that provide haptic feedback | Michael B. Nussbaum, Daniel D. Sunshine, Christopher A. Schultz, Daniel A. Podhajny | 2019-01-29 |
| 8789271 | Method for integrating an electronic component into a printed circuit board | Günther Weichslberger, Arno Kriechbaum, Mike Morianz, Nikolai Haslebner, Johannes Stahr +5 more | 2014-07-29 |