Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12376231 | Three-dimensional (3D) copper in printed circuit boards | Chad O. Simpson, William Hannon, Mark J. Beesley | 2025-07-29 |
| 12135592 | Printed circuits with embedded resistive thermal devices | — | 2024-11-05 |
| 11971760 | Printed circuits with embedded resistive thermal devices | — | 2024-04-30 |
| 11956898 | Three-dimensional (3D) copper in printed circuit boards | Chad O. Simpson, William Hannon, Mark J. Beesley | 2024-04-09 |
| 10420213 | Segmented via for vertical PCB interconnect | Mark J. Beesley, Albert A. Onderick, II, Craig A. Gammel, Shawn X. Arnold | 2019-09-17 |
| 9812401 | Techniques for observing an entire communication bus in operation | Peter J. Johnston, Christine Laliberte, Dominic Paul McCarthy, Shawn X. Arnold, Souvik Mukherjee | 2017-11-07 |
| 9763329 | Techniques for observing an entire communication bus in operation | Peter J. Johnston, Christine Laliberte, Dominic Paul McCarthy, Shawn X. Arnold, Souvik Mukherjee | 2017-09-12 |
| 9593991 | Printed circuits with embedded strain gauges | Bryan McDonald, Shawn X. Arnold, Matthew P. Casebolt, Dennis R. Pyper | 2017-03-14 |