Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10932366 | Low profile packaging and assembly of a power conversion system in modular form | Sunil M. Akre | 2021-02-23 |
| 10783347 | Capacitive sensor packaging | Benjamin J. Pope, Barry Corlett, Terry L. Gilton, Syed Husaini, Steven Webster +3 more | 2020-09-22 |
| 10455707 | Connection pad for embedded components in PCB packaging | Kenneth Leland Kiplinger, Mark J. Beesley, Shyam Harindralal Ratnayake, Meng Chi Lee | 2019-10-22 |
| 10423815 | Capacitive sensor packaging | Benjamin J. Pope, Barry Corlett, Terry L. Gilton, Syed Husaini, Steven Webster +3 more | 2019-09-24 |
| 10420213 | Segmented via for vertical PCB interconnect | Mark J. Beesley, Albert A. Onderick, II, Anne M. Mason, Craig A. Gammel | 2019-09-17 |
| 10179254 | Capacitor structure with acoustic noise self-canceling characteristics | Paul A. Martinez, Jason C. Sauers | 2019-01-15 |
| 10007832 | Capacitive sensor packaging | Benjamin J. Pope, Barry Corlett, Terry L. Gilton, Syed Husaini, Steven Webster +3 more | 2018-06-26 |
| 10007833 | Capacitive sensor packaging | Benjamin J. Pope, Barry Corlett, Terry L. Gilton, Syed Husaini, Steven Webster +3 more | 2018-06-26 |
| 9936579 | Low profile packaging and assembly of a power conversion system in modular form | Sunil M. Akre | 2018-04-03 |
| 9812401 | Techniques for observing an entire communication bus in operation | Anne M. Mason, Peter J. Johnston, Christine Laliberte, Dominic Paul McCarthy, Souvik Mukherjee | 2017-11-07 |
| 9805867 | Acoustically quiet capacitors | Jeffrey M. Thoma, Connor R. Duke, Yanchu Xu, Nelson J. Kottke | 2017-10-31 |
| 9763329 | Techniques for observing an entire communication bus in operation | Anne M. Mason, Peter J. Johnston, Christine Laliberte, Dominic Paul McCarthy, Souvik Mukherjee | 2017-09-12 |
| 9715964 | Ceramic capacitors with built-in EMI shield | Gang Ning, Pradeep Vengavasi, Linda Y. Dunn, Yonas A. Hartanto | 2017-07-25 |
| 9664747 | Electronic devices with magnetic sensors | Henry H. Yang, Chiajen Lee | 2017-05-30 |
| 9593991 | Printed circuits with embedded strain gauges | Anne M. Mason, Bryan McDonald, Matthew P. Casebolt, Dennis R. Pyper | 2017-03-14 |
| 9576178 | Capacitive sensor packaging | Benjamin J. Pope, Barry Corlett, Terry L. Gilton, Syed Husaini, Steven Webster +3 more | 2017-02-21 |
| 9455539 | Connector having printed circuit with embedded die | Corey N. Axelowitz, Ling Zhang | 2016-09-27 |
| 9443830 | Printed circuits with embedded semiconductor dies | Corey N. Axelowitz, Eric Lee | 2016-09-13 |
| 9402316 | Methods for forming a sensor array package | Terry L. Gilton, Matthew E. Last | 2016-07-26 |
| 9330943 | Low cost repackaging of thinned integrated devices | — | 2016-05-03 |
| 9287049 | Low acoustic noise capacitors | Gang Ning, Jeffrey M. Thoma, Henry H. Yang | 2016-03-15 |
| 9268989 | Capacitive sensor packaging | Benjamin J. Pope, Barry Corlett, Terry L. Gilton, Syed Husaini, Steven Webster +3 more | 2016-02-23 |
| 9215807 | Small form factor stacked electrical passive devices that reduce the distance to the ground plane | Jeffrey M. Thoma | 2015-12-15 |
| 9196958 | Antenna structures and shield layers on packaged wireless circuits | Dennis R. Pyper, Jeffrey M. Thoma, Scott Mullins | 2015-11-24 |
| 9190379 | Perimeter trench sensor array package | Matthew E. Last | 2015-11-17 |