Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12245377 | Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled | Andreas Zluc, Mike Morianz, Heinz Moitzi | 2025-03-04 |
| 12185478 | Printed circuit board having embedded component | Gerald Weidinger, Andreas Zluc | 2024-12-31 |
| 12165940 | Component carrier with surface-contactable component embedded in laminated stack | Heinz Moitzi, Andreas Zluc | 2024-12-10 |
| 12002614 | Inductor made of component carrier material comprising electrically conductive plate structures | Gerald Weidinger, Heinz Moitzi | 2024-06-04 |
| 11799198 | Component carrier-based device with antenna coupling of electronic component and thermal coupling on opposing sides | Mario Schober | 2023-10-24 |
| 11792932 | Component carrier with embedded magnetic inlay and integrated coil structure | Ivan Salkovic, Gerald Weidinger | 2023-10-17 |
| 11749573 | Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity | Gerald Weidinger, Gerhard Schmid, Andreas Zluc | 2023-09-05 |
| 11682661 | Hermetic optical component package having organic portion and inorganic portion | Andreas Zluc | 2023-06-20 |
| 11658142 | Connection arrangement, component carrier and method of forming a component carrier structure | Heinz Moitzi, Andreas Zluc | 2023-05-23 |
| 11523520 | Method for making contact with a component embedded in a printed circuit board | Gerald Weidinger, Andreas Zluc | 2022-12-06 |
| 11495513 | Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled | Andreas Zluc, Mike Morianz, Heinz Moitzi | 2022-11-08 |
| 11324122 | Component carrier and method of manufacturing the same | Heinz Moitzi, Mike Morianz | 2022-05-03 |
| 11264708 | Component carrier with integrated antenna structure | Thomas Kristl, Martin Reiter, Markus Leitgeb, Gernot Grober, Erich Schlaffer | 2022-03-01 |
| 11172576 | Method for producing a printed circuit board structure | Mike Morianz | 2021-11-09 |
| 11049778 | Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity | Gerald Weidinger, Gerhard Schmid, Andreas Zluc | 2021-06-29 |
| 10867888 | Component carrier comprising at least one heat pipe and method for producing said component carrier | Jonathan Silvano de Sousa, Bernhard Reitmaier, Erich Schlaffer, Wolfgang Schrittwieser, Gerald Weidinger +2 more | 2020-12-15 |
| 10861636 | Inductor made of component carrier material comprising electrically conductive plate structures | Gerald Weidinger, Heinz Moitzi | 2020-12-08 |
| 10863631 | Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure | Timo Schwarz, Mario Schober | 2020-12-08 |
| 10779413 | Method of embedding a component in a printed circuit board | Timo Schwarz, Andreas Zluc, Gregor Langer | 2020-09-15 |
| 10665526 | Component carrier comprising at least one heat pipe and method for producing said component carrier | Jonathan Silvano de Sousa, Bernhard Reitmaier, Erich Schlaffer, Wolfgang Schrittwieser, Gerald Weidinger +2 more | 2020-05-26 |
| 10617012 | Methods of manufacturing flexible printed circuit boards | Andreas Zluc | 2020-04-07 |
| 10426040 | Method for producing a circuit board element | Andreas Zluc | 2019-09-24 |
| 10356904 | Conductor track with enlargement-free transition between conductor path and contact structure | Wolfgang Schrittwieser, Mike Morianz, Christian Vockenberger, Markus Leitgeb | 2019-07-16 |
| 10332818 | Efficient heat removal from component carrier with embedded diode | Mike Morianz, Gerald Weis | 2019-06-25 |
| 10283680 | Method for the production of an electronic module having an electronic component embedded therein | Gregor Langer | 2019-05-07 |