Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12096555 | Component carrier with stack-stack connection for connecting components | Markus Leitgeb | 2024-09-17 |
| 11450587 | Heat removal mechanism for stack-based electronic device with process control component and processing components | Marco Gavagnin, Gerald Weis, Markus Leitgeb, Young Hy Jung | 2022-09-20 |
| 11264708 | Component carrier with integrated antenna structure | Thomas Kristl, Martin Reiter, Johannes Stahr, Markus Leitgeb, Erich Schlaffer | 2022-03-01 |
| 11184983 | Embedding known-good component between known-good component carrier blocks with late formed electric connection structure | Marco Gavagnin, Christian Vockenberger | 2021-11-23 |
| 11178772 | Component carrier connected with a separate tilted component carrier for short electric connection | Gerald Weis | 2021-11-16 |
| 11129314 | Stepped component assembly accommodated within a stepped cavity in component carrier | Sabine Liebfahrt, Christian Vockenberger | 2021-09-21 |
| 10905016 | Using a partially uncured component carrier body for manufacturing component carrier | Sabine Liebfahrt, Marco Gavagnin | 2021-01-26 |
| 10897308 | Integration of all components being necessary for transmitting/receiving electromagnetic radiation in a component carrier | Jonathan Silvano de Sousa | 2021-01-19 |
| 10867888 | Component carrier comprising at least one heat pipe and method for producing said component carrier | Jonathan Silvano de Sousa, Bernhard Reitmaier, Erich Schlaffer, Johannes Stahr, Wolfgang Schrittwieser +2 more | 2020-12-15 |
| 10665526 | Component carrier comprising at least one heat pipe and method for producing said component carrier | Jonathan Silvano de Sousa, Bernhard Reitmaier, Erich Schlaffer, Johannes Stahr, Wolfgang Schrittwieser +2 more | 2020-05-26 |
| 10531577 | Forming through holes through exposed dielectric material of component carrier | — | 2020-01-07 |
| 10440835 | Forming through holes through exposed dielectric material of component carrier | — | 2019-10-08 |
| 10368448 | Method of manufacturing a component carrier | Marco Gavagnin, Christian Vockenberger | 2019-07-30 |
| 10045443 | Matching inclination of cavity sidewall and medium supply device for manufacturing component carrier | Markus Leitgeb | 2018-08-07 |
| 9418930 | Power module | Johannes Stahr, Andreas Zluc, Timo Schwarz | 2016-08-16 |