Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450587 | Heat removal mechanism for stack-based electronic device with process control component and processing components | Marco Gavagnin, Gerald Weis, Markus Leitgeb, Gernot Grober | 2022-09-20 |
| 8024857 | Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same | Jae Sung Oh, Ki Il MOON, Ki Chae Kim, Chan Sun Lee, Jin Ho Gwon +1 more | 2011-09-27 |
| 7652362 | Semiconductor package stack with through-via connection | Chan Sun Lee | 2010-01-26 |