Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735559 | Semiconductor packages and manufacturing methods for the same | — | 2023-08-22 |
| 11437342 | Semiconductor packages and manufacturing methods for the same | — | 2022-09-06 |
| 8024857 | Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same | Young Hy Jung, Jae Sung Oh, Ki Il MOON, Ki Chae Kim, Jin Ho Gwon +1 more | 2011-09-27 |
| 7652362 | Semiconductor package stack with through-via connection | Young Hy Jung | 2010-01-26 |