Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9184155 | Semiconductor package | Jong Hyun Kim | 2015-11-10 |
| 9030009 | Stacked semiconductor package and method for manufacturing the same | Jae Sung Oh | 2015-05-12 |
| 8024857 | Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same | Young Hy Jung, Jae Sung Oh, Ki Chae Kim, Chan Sun Lee, Jin Ho Gwon +1 more | 2011-09-27 |