Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424504 | Component embedded in component carrier and having an exposed side wall | Bettina Schuster, Jonathan Silvano de Sousa, Markus Leitgeb, Hannes Stahr | 2025-09-23 |
| 12400968 | Component with dielectric layer for embedding in component carrier | Gerald Weidinger | 2025-08-26 |
| 12245377 | Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled | Johannes Stahr, Mike Morianz, Heinz Moitzi | 2025-03-04 |
| 12185478 | Printed circuit board having embedded component | Gerald Weidinger, Johannes Stahr | 2024-12-31 |
| 12165940 | Component carrier with surface-contactable component embedded in laminated stack | Heinz Moitzi, Johannes Stahr | 2024-12-10 |
| 12075561 | Embedding component in component carrier by component fixation structure | Timo Schwarz, Mario Schober | 2024-08-27 |
| 11749573 | Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity | Johannes Stahr, Gerald Weidinger, Gerhard Schmid | 2023-09-05 |
| 11749613 | Component with dielectric layer for embedding in component carrier | Gerald Weidinger | 2023-09-05 |
| 11682661 | Hermetic optical component package having organic portion and inorganic portion | Johannes Stahr | 2023-06-20 |
| 11658142 | Connection arrangement, component carrier and method of forming a component carrier structure | Heinz Moitzi, Johannes Stahr | 2023-05-23 |
| 11570897 | Component embedded in component carrier and having an exposed side wall | Bettina Schuster, Jonathan Silvano de Sousa, Markus Leitgeb, Hannes Stahr | 2023-01-31 |
| 11523520 | Method for making contact with a component embedded in a printed circuit board | Gerald Weidinger, Johannes Stahr | 2022-12-06 |
| 11495513 | Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled | Johannes Stahr, Mike Morianz, Heinz Moitzi | 2022-11-08 |
| 11171092 | Component with dielectric layer for embedding in component carrier | Gerald Weidinger | 2021-11-09 |
| 11049778 | Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity | Johannes Stahr, Gerald Weidinger, Gerhard Schmid | 2021-06-29 |
| 10779413 | Method of embedding a component in a printed circuit board | Timo Schwarz, Gregor Langer, Johannes Stahr | 2020-09-15 |
| 10765005 | Embedding component with pre-connected pillar in component carrier | Hannes Stahr, Hannes Voraberger, Bettina Schuster | 2020-09-01 |
| 10709023 | Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate | Gerald Weidinger, Timo Schwarz | 2020-07-07 |
| 10617012 | Methods of manufacturing flexible printed circuit boards | Johannes Stahr | 2020-04-07 |
| 10426040 | Method for producing a circuit board element | Johannes Stahr | 2019-09-24 |
| 10306750 | Circuit board and method for manufacturing a circuit board | Hannes Stahr, Timo Schwarz, Gerald Weidinger | 2019-05-28 |
| 10187997 | Method for making contact with a component embedded in a printed circuit board | Gerald Weidinger, Johannes Stahr | 2019-01-22 |
| 9967972 | Circuit board having an asymmetric layer structure | Gerald Weidinger, Mario Schober, Hannes Stahr, Timo Schwarz, Benjamin Gruber | 2018-05-08 |
| 9418930 | Power module | Johannes Stahr, Gernot Grober, Timo Schwarz | 2016-08-16 |
| 9253888 | Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product | Gerald Weidinger, Johannes Stahr | 2016-02-02 |