Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400968 | Component with dielectric layer for embedding in component carrier | Andreas Zluc | 2025-08-26 |
| 12185478 | Printed circuit board having embedded component | Andreas Zluc, Johannes Stahr | 2024-12-31 |
| 12112888 | Component carrier with cavity accommodating at least part of driven body being magnetically drivable to move | Gerald Weis, Sebastian Sattler, Patrick Fleischhacker | 2024-10-08 |
| 12002614 | Inductor made of component carrier material comprising electrically conductive plate structures | Johannes Stahr, Heinz Moitzi | 2024-06-04 |
| 11889629 | Component carrier comprising embedded magnet stack | Gerald Weis, Ivan Salkovic, Karl Kirchheimer | 2024-01-30 |
| 11792932 | Component carrier with embedded magnetic inlay and integrated coil structure | Ivan Salkovic, Johannes Stahr | 2023-10-17 |
| 11749613 | Component with dielectric layer for embedding in component carrier | Andreas Zluc | 2023-09-05 |
| 11749573 | Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity | Johannes Stahr, Gerhard Schmid, Andreas Zluc | 2023-09-05 |
| 11523520 | Method for making contact with a component embedded in a printed circuit board | Andreas Zluc, Johannes Stahr | 2022-12-06 |
| 11171092 | Component with dielectric layer for embedding in component carrier | Andreas Zluc | 2021-11-09 |
| 11049778 | Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity | Johannes Stahr, Gerhard Schmid, Andreas Zluc | 2021-06-29 |
| 10993313 | Non-uniform magnetic foil embedded in component carrier | Jonathan Silvano de Sousa | 2021-04-27 |
| 10867888 | Component carrier comprising at least one heat pipe and method for producing said component carrier | Jonathan Silvano de Sousa, Bernhard Reitmaier, Erich Schlaffer, Johannes Stahr, Wolfgang Schrittwieser +2 more | 2020-12-15 |
| 10861636 | Inductor made of component carrier material comprising electrically conductive plate structures | Johannes Stahr, Heinz Moitzi | 2020-12-08 |
| 10709023 | Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate | Timo Schwarz, Andreas Zluc | 2020-07-07 |
| 10665526 | Component carrier comprising at least one heat pipe and method for producing said component carrier | Jonathan Silvano de Sousa, Bernhard Reitmaier, Erich Schlaffer, Johannes Stahr, Wolfgang Schrittwieser +2 more | 2020-05-26 |
| 10455703 | Method for producing a printed circuit board with an embedded sensor chip, and printed circuit board | — | 2019-10-22 |
| 10306750 | Circuit board and method for manufacturing a circuit board | Hannes Stahr, Andreas Zluc, Timo Schwarz | 2019-05-28 |
| 10187997 | Method for making contact with a component embedded in a printed circuit board | Andreas Zluc, Johannes Stahr | 2019-01-22 |
| 10051747 | Method for the production of a circuit board involving the removal of a subregion thereof | Markus Leitgeb, Gerhard Schmid, Ljubomir Mareljic, Volodymyr Karpovych | 2018-08-14 |
| 9967972 | Circuit board having an asymmetric layer structure | Andreas Zluc, Mario Schober, Hannes Stahr, Timo Schwarz, Benjamin Gruber | 2018-05-08 |
| 9253888 | Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product | Andreas Zluc, Johannes Stahr | 2016-02-02 |
| 8685196 | Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method | Günther Weichslberger, Johannes Stahr, Markus Leitgeb, Andreas Zluc | 2014-04-01 |
| 8541689 | Method for removing a part of a planar material layer and multilayer structure | Markus Leitgeb, Johannes Stahr, Günther Weichslberger, Andreas Zluc | 2013-09-24 |
| 8388792 | Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor | Günther Weichslberger, Markus Leitgeb, Johannes Stahr | 2013-03-05 |