Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12075561 | Embedding component in component carrier by component fixation structure | Timo Schwarz, Andreas Zluc | 2024-08-27 |
| 11864319 | Z-axis interconnection with protruding component | Markus Leitgeb | 2024-01-02 |
| 11799198 | Component carrier-based device with antenna coupling of electronic component and thermal coupling on opposing sides | Johannes Stahr | 2023-10-24 |
| 10863631 | Layer stack of component carrier material with embedded components and common high temperature robust dielectric structure | Johannes Stahr, Timo Schwarz | 2020-12-08 |
| 9967972 | Circuit board having an asymmetric layer structure | Andreas Zluc, Gerald Weidinger, Hannes Stahr, Timo Schwarz, Benjamin Gruber | 2018-05-08 |