Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461009 | Method and apparatus for assembling a semiconductor package | Leo M. Higgins, III | 2016-10-04 |
| 9142502 | Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits | Zhiwei Gong, Navjot Chhabra, Scott M. Hayes, Douglas G. Mitchell, Jason Wright | 2015-09-22 |
| 9059144 | Method for forming die assembly with heat spreader | Leo M. Higgins, III, Burton J. Carpenter | 2015-06-16 |
| 8916421 | Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits | Zhiwei Gong, Navjot Chhabra, Scott M. Hayes | 2014-12-23 |
| 8645673 | Multicore processor and method of use that adapts core functions based on workload execution | Robert H. Bell, Jr., Louis Bennie Capps, Jr., Thomas E. Cook, Ronald E. Newhart, Michael A. Paolini +1 more | 2014-02-04 |
| 8597983 | Semiconductor device packaging having substrate with pre-encapsulation through via formation | Zhiwei Gong, Navjot Chhabra, Scott M. Hayes | 2013-12-03 |
| 8327126 | Multicore processor and method of use that adapts core functions based on workload execution | Robert H. Bell, Jr., Louis Bennie Capps, Jr., Thomas E. Cook, Ronald E. Newhart, Michael A. Paolini +1 more | 2012-12-04 |
| 7900809 | Solder interconnection array with optimal mechanical integrity | David L. Edwards, Mukta G. Farooq, Frank L. Pompeo | 2011-03-08 |
| 7667470 | Power grid structure to optimize performance of a multiple core processor | Jean Audet, Louis Bennie Capps, Jr., Anand Haridass, Ronald E. Newhart, Michael J. Shapiro | 2010-02-23 |
| 7445141 | Solder interconnection array with optimal mechanical integrity | David L. Edwards, Mukta G. Farooq, Frank L. Pompeo | 2008-11-04 |
| 7420378 | Power grid structure to optimize performance of a multiple core processor | Jean Audet, Louis Bennie Capps, Jr., Anand Haridass, Ronald E. Newhart, Michael J. Shapiro | 2008-09-02 |
| 7405247 | Conductive adhesive composition | Krishna G. Sachdev, Daniel G. Berger, Kelly Chioujones, Hilton T. Toy | 2008-07-29 |
| 7393419 | Conductive adhesive rework method | Krishna G. Sachdev, Daniel G. Berger, Kelly Chioujones, Hilton T. Toy | 2008-07-01 |
| 7312261 | Thermal interface adhesive and rework | Krishna G. Sachdev, Daniel G. Berger, Kelly Chioujones, Hilton T. Toy | 2007-12-25 |
| 7268570 | Apparatus and method for customized burn-in of cores on a multicore microprocessor integrated circuit chip | Jean Audet, Louis Bennie Capps, Jr., Joanne Ferris, Anand Haridass, Ronald E. Newhart +1 more | 2007-09-11 |
| 7239516 | Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip | David C. Long, David L. Edwards, Ronald L. Hering, Sushumna Iruvanti, Kenneth C. Marston +1 more | 2007-07-03 |
| 7079393 | Fluidic cooling systems and methods for electronic components | Evan G. Colgan, Frank L. Pompeo, Hilton T. Toy, Bruce K. Furman, David L. Edwards +7 more | 2006-07-18 |
| 6974722 | Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules | Jason L. Frankel, William F. Shutler, Anthony Wayne Sigler, Herbert I. Stoller, John Vetrero +1 more | 2005-12-13 |
| 6878608 | Method of manufacture of silicon based package | Peter J. Brofman, Sudipta K. Ray, Herbert I. Stoller | 2005-04-12 |
| 6762489 | Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules | Jason L. Frankel, William F. Shutler, Anthony Wayne Sigler, Herbert I. Stoller, John Vetrero +1 more | 2004-07-13 |
| 6541365 | Insulating interposer between two electronic components and process thereof | David L. Edwards, Norman J. Dauerer | 2003-04-01 |
| 6444496 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof | David L. Edwards, Shaji Farooq, Sushumna Iruvanti, Frank L. Pompeo | 2002-09-03 |
| 6365977 | Insulating interposer between two electronic components and process thereof | David L. Edwards, Norman J. Dauerer | 2002-04-02 |
| 6292369 | Methods for customizing lid for improved thermal performance of modules using flip chips | David L. Edwards | 2001-09-18 |
| 6275381 | Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof | David L. Edwards, Shaji Farooq, Sushumna Iruvanti, Frank L. Pompeo | 2001-08-14 |