Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12359306 | Deposition processing systems having active temperature control and associated methods | Angus McFadden | 2025-07-15 |
| 12333074 | Systems for controlling one or more devices using a signal control unit | Thomas James OXLEY, Swagata R. Banerjee, Evan Schnell, Carl D. Wahlstrand, Darragh McDermott +2 more | 2025-06-17 |
| 12223106 | Systems and methods for generic control using a neural signal | Thomas James OXLEY | 2025-02-11 |
| 11718905 | Functionally integrated coating structures | Nader M. Kalkhoran, Eric Tobin, Tim Egge, Jason Burns, Rick Oliver +1 more | 2023-08-08 |
| 11673161 | Methods of manufacturing electrostatic chucks | Angus McFadden | 2023-06-13 |
| 11332821 | Deposition processing systems having active temperature control and associated methods | Angus McFadden | 2022-05-17 |
| 11307970 | Systems and methods for quality control application and testing from profile discovery | — | 2022-04-19 |
| 10998231 | Method for increasing semiconductor device wafer strength | Colby Greg Rampley, Alan J. Magnus, Jeffrey Lynn Weibrecht, Elijah Blue Foster | 2021-05-04 |
| 10727195 | Bond materials with enhanced plasma resistant characteristics and associated methods | Angus McFadden | 2020-07-28 |
| 10340251 | Method for making an electronic component package | Alan J. Magnus, Jeffrey Lynn Weibrecht, Colby Greg Rampley | 2019-07-02 |
| 9899298 | Microelectronic packages having mold-embedded traces and methods for the production thereof | Michael B. Vincent, Zhiwei Gong | 2018-02-20 |
| 9761570 | Electronic component package with multple electronic components | Michael B. Vincent | 2017-09-12 |
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Alan J. Magnus +3 more | 2016-11-22 |
| 9331029 | Microelectronic packages having mold-embedded traces and methods for the production thereof | Michael B. Vincent, Zhiwei Gong | 2016-05-03 |
| 9305911 | Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication | Michael B. Vincent, Weng F. Yap | 2016-04-05 |
| 9299670 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Weng F. Yap, Michael B. Vincent | 2016-03-29 |
| 9281293 | Microelectronic packages having layered interconnect structures and methods for the manufacture thereof | Alan J. Magnus, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell +2 more | 2016-03-08 |
| 9257415 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Michael B. Vincent, Scott M. Hayes, Zhiwei Gong | 2016-02-09 |
| 9190390 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Zhiwei Gong, Michael B. Vincent, Scott M. Hayes | 2015-11-17 |
| 9142502 | Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits | Zhiwei Gong, Navjot Chhabra, Glenn G. Daves, Scott M. Hayes, Douglas G. Mitchell | 2015-09-22 |
| 9093457 | Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof | Zhiwei Gong, Michael B. Vincent, Scott M. Hayes | 2015-07-28 |
| 9064977 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Zhiwei Gong (Tony), Michael B. Vincent, Scott M. Hayes | 2015-06-23 |
| 9025340 | Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabrication | Michael B. Vincent, Weng F. Yap | 2015-05-05 |
| 8925481 | Systems and methods for measuring, monitoring and controlling ozone concentration | ShouQian Shao, Jay DeDontney | 2015-01-06 |
| 8906790 | Combinatorial approach for screening of ALD film stacks | Albert S. Lee, Tony P. Chiang | 2014-12-09 |