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Jason Wright — 34 Patents

FSFreeescale Semiconductor: 13 patents #207 of 3,767Top 6%

INIntermolecular: 6 patents #93 of 248Top 40%

TGTechnetics Group: 5 patents #3 of 43Top 7%

NUNxp Usa: 4 patents #422 of 2,066Top 25%

SLSynchron Australia Pty Limited: 2 patents #6 of 12Top 50%

Lam Research: 1 patents #1,379 of 2,128Top 65%

T-Mobile Usa: 1 patents #765 of 1,165Top 70%

Applied Materials: 1 patents #4,824 of 7,310Top 70%

Santa Clara, CA: #397 of 9,301 inventorsTop 5%

California: #14,619 of 386,348 inventorsTop 4%

Overall (All Time): #100,737 of 4,157,543Top 3%

34 Patents All Time

Jason Wright has been granted 34 US patents while listed as an inventor at Freeescale Semiconductor. The first was granted in 2004 and the most recent in July 2025. Jason Wright ranks #100,737 of 4,157,543 US inventors in our database (top 2.4%). Patent records list Jason Wright in Santa Clara, CA, US.

Patents per Year

Issued Patents All Time

Showing 1–25 of 34 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12359306	Deposition processing systems having active temperature control and associated methods	Angus McFadden	2025-07-15
12333074	Systems for controlling one or more devices using a signal control unit	Thomas James OXLEY, Swagata R. Banerjee, Evan Schnell, Carl D. Wahlstrand, Darragh McDermott +2 more	2025-06-17
12223106	Systems and methods for generic control using a neural signal	Thomas James OXLEY	2025-02-11
11718905	Functionally integrated coating structures	Nader M. Kalkhoran, Eric Tobin, Tim Egge, Jason Burns, Rick Oliver +1 more	2023-08-08
11673161	Methods of manufacturing electrostatic chucks	Angus McFadden	2023-06-13
11332821	Deposition processing systems having active temperature control and associated methods	Angus McFadden	2022-05-17
11307970	Systems and methods for quality control application and testing from profile discovery	—	2022-04-19	$71,182,000
10998231	Method for increasing semiconductor device wafer strength	Colby Greg Rampley, Alan J. Magnus, Jeffrey Lynn Weibrecht, Elijah Blue Foster	2021-05-04	$26,002,000
10727195	Bond materials with enhanced plasma resistant characteristics and associated methods	Angus McFadden	2020-07-28
10340251	Method for making an electronic component package	Alan J. Magnus, Jeffrey Lynn Weibrecht, Colby Greg Rampley	2019-07-02	$19,005,000
9899298	Microelectronic packages having mold-embedded traces and methods for the production thereof	Michael B. Vincent, Zhiwei Gong	2018-02-20	$6,607,000
9761570	Electronic component package with multple electronic components	Michael B. Vincent	2017-09-12	$21,434,000
9502363	Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers	Michael B. Vincent, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Alan J. Magnus +3 more	2016-11-22
9331029	Microelectronic packages having mold-embedded traces and methods for the production thereof	Michael B. Vincent, Zhiwei Gong	2016-05-03
9305911	Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication	Michael B. Vincent, Weng F. Yap	2016-04-05
9299670	Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof	Weng F. Yap, Michael B. Vincent	2016-03-29
9281293	Microelectronic packages having layered interconnect structures and methods for the manufacture thereof	Alan J. Magnus, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell +2 more	2016-03-08
9257415	Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof	Michael B. Vincent, Scott M. Hayes, Zhiwei Gong	2016-02-09
9190390	Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof	Zhiwei Gong, Michael B. Vincent, Scott M. Hayes	2015-11-17	$6,966,000
9142502	Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits	Zhiwei Gong, Navjot Chhabra, Glenn G. Daves, Scott M. Hayes, Douglas G. Mitchell	2015-09-22
9093457	Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof	Zhiwei Gong, Michael B. Vincent, Scott M. Hayes	2015-07-28	$3,725,000
9064977	Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof	Zhiwei Gong (Tony), Michael B. Vincent, Scott M. Hayes	2015-06-23	$8,829,000
9025340	Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabrication	Michael B. Vincent, Weng F. Yap	2015-05-05	$12,329,000
8925481	Systems and methods for measuring, monitoring and controlling ozone concentration	ShouQian Shao, Jay DeDontney	2015-01-06	$359,000
8906790	Combinatorial approach for screening of ALD film stacks	Albert S. Lee, Tony P. Chiang	2014-12-09	$262,000